Put aside AOT, the company's prime customers of LED lead frames
also include Lite-On Group and Sharp.
This press release contains forward-looking statements within the meaning of federal securities laws, including, without limitation, statements regarding plans to increase MicroLeadFrame(R) package production capacity; growth potential for package shipments for 2004 and beyond; plans to develop and qualify an ultra high density lead frame
punch manufacturing process that can increase the number of packages per lead frame
strip by between 40% and 100%; and our assertions that our MicroLeadFrame(R) package will be even more cost competitive with the SOIC package and that this will accelerate migration into the MicroLeadFrame(R) package format.
DNP has established a technology which leaves only the necessary circuit portion of the lead frame
, removes the plate mounting for the IC chip, and in cases where it is structurally necessary, etches the lead frame
portionused for mounting the IC chip into a concave shape, into which the IC chip is then embedded.
After joining Samsung's supply chain of LED lead frames
, the firm is expected to enjoy a 40% growth in its business operation and rake in NT$1.
DALLAS, May 22, 2015 /PRNewswire-iReach/ -- The 2014 Lead frame
Industry Report -- Global and Chinese Market Scenario is an exhaustive study on the present market scenario of the global Lead frame
industry with a special focus on the China market of this industry.
The M21428 video cable driver is packaged in a new high-performance micro lead frame
(MLF) RoHS (green) compliant package that simplifies circuit board layout and reduces footprint requirements.
Optimized die and lead frame
design to reduce package resistance and inductance, reducing conduction and source terminal inductance switching losses; and
The high-speed digital optocoupler also comes with enhanced wire bonding processes and an improved lead frame
for added reliability and better heat dissipation.
Kitakyushu, Japan, is one of the leading lead frame
suppliers for the IC industry and a major player in the IC assembly business.
These second-generation products herald the introduction of mold-array processed lead-frame packaging that uses the lead frame
and exposed bottom slug as part of the circuit.