Compact package reduces mounting area
and requires fewer external parts The BD9G341AEFJ is offered in a compact 8pin package (4.
This AuSn alloy lid is a component to manufacture the so-called 1210-size crystal oscillators with a mounting area
The ultra compact LMOS circuits in fSV packaging, an original development by Toshiba, provide an innovative solution that requires only one-eightieth of the mounting area
for a SOP conventional small outline package.
2) 8-pin HVSON package with small mounting area
and support for large-current control
The compressor must be mounted on the existing equipment pad with existing motor, without modification to the outside dimension of the concrete housekeeping pad or compressor mounting area
of the steel bedplate.
Integrated 2A li-ion battery charger with 30V overvoltage protection function reduces mounting area
considerably Lithium ion and lithium polymer batteries are used in a wide range of portable devices due to their compact form factor and high energy density.
It is easy to install and mount the wall without lighting fixtures, by firstly stabilize mounting bracket on mounting area
with screws, and secondly snap tube fixture onto the bracket, therefore, connect to AC circuit.
Conventionally, it has been difficult to incorporate SDR into mobile equipment since the existing SDR technology relied upon selective switching of transceiver devices, which resulted in a large mounting area
of existing chips for each wireless standard.
Designed for embedding in such products as mobile phones, personal digital assistants and digital cameras, the two AND-type flash memories - the 128Mb HN29W12811BP-60 and the 256Mb HN29V25611ABP-50 - offer a mounting area
that is approximately 43% of Hitachi's TSOP products.
However, systems for large-current charging employ multiple power metal-oxide-semiconductor field-effect transistors (MOSFETs) and discrete passive components, and large-scale heat emission structure under large-current handling, while they need mounting area
compactness especially for mobile devices.
The BD14000EFV-C integrates over 20 discrete components required for supercap cell balancing on a single chip, reducing mounting area
by 38% over conventional solutions while eliminating component variations, making it easy to configure compact, high reliability supercap systems.
To satisfy the second requirement, although mounting area
is spreading according to electric source increasing, the RAA20770X devices achieve a size reduction of about 75 percent compared to earlier Renesas products, featuring an ultra-miniature wafer-level chip size package that is essentially the same size as the chip itself.