Major Binders and their Advantages & Disadvantages: Silicon-Modified Phenolic Resin, Epoxy-Modified Phenolic Resin, Phenolic Resin, COPNA Resin, Thermoplastic Polyimide Resin
, and Cyanate Ester Resin
Substrate Flexible Film: Polyimide, PET, LCP, PEN, PEEK Others: Paper, cloth, metal foil, hybrid material Conductor Silver powder, copper powder, carbon powder Metal coated plastic Nano particulate powder Insulation Epoxy resin, acrylic resin, polyester resin, polyimide resin
Functional Piezo electric materials Optical Organic electroluminescence materials, transparent resins Interconnection Anisotropic conductive paste, ACF Active material Semiconductor paste Shielding Silver paste, carbon paste TABLE 2.
Japanese chemical company "Foray developed a new photosensitive polyimide resin
with a curing temperature below 200[degrees]C for use in semiconductor device protection.
is highly heat resistant and has a low dielectric constant, allowing the FPC to achieve improved reliability and reduced transmission losses.
The thermally cured polyimide resin
plate was removed from the mold at room temperature.
The new foil has high bond strength with polyimide resin
for high flexing endurance.
won the Commercial Invention of the Year Award for development of a thermosetting (permanently solidifying when heated) high-temperature polyimide resin
has appointed DuPont Vespel Parts and Shapes to be the exclusive distributor for Mitsui's Aurum thermoplastic polyimide resin
in the U.
Unitech also markets RP46, a polyimide resin
licensed from NASA that is capable of withstanding continuous temperatures of 700 F.
85NT is a polyimide resin
system with a nonwoven aramid reinforcement that was originally developed to provide high Tg (240[degrees]C) and low X-Y CTE (6-9 ppm/[degrees]C) for reliable direct SMT applications involving leadless ceramic chip packages.
DuPont recently launched a thermoplastic polyimide resin
, Vespel TP 8556.
Nitto Denko's ASMAT substrate features conductive metal layers coated with polyimide resin