polyimide resin

polyimide resin

[¦päl·ē′i‚mīd ‚rez·ən]
(organic chemistry)
An aromatic polyimide made by reacting pyromellitic dianhydride with an aromatic diamine; has high resistance to thermal stresses; used to make components of internal combustion engines.
References in periodicals archive ?
Major Binders and their Advantages & Disadvantages: Silicon-Modified Phenolic Resin, Epoxy-Modified Phenolic Resin, Phenolic Resin, COPNA Resin, Thermoplastic Polyimide Resin, and Cyanate Ester Resin
Substrate Flexible Film: Polyimide, PET, LCP, PEN, PEEK Others: Paper, cloth, metal foil, hybrid material Conductor Silver powder, copper powder, carbon powder Metal coated plastic Nano particulate powder Insulation Epoxy resin, acrylic resin, polyester resin, polyimide resin Functional Piezo electric materials Optical Organic electroluminescence materials, transparent resins Interconnection Anisotropic conductive paste, ACF Active material Semiconductor paste Shielding Silver paste, carbon paste TABLE 2.
Japanese chemical company "Foray developed a new photosensitive polyimide resin with a curing temperature below 200[degrees]C for use in semiconductor device protection.
Polyimide resin is highly heat resistant and has a low dielectric constant, allowing the FPC to achieve improved reliability and reduced transmission losses.
The thermally cured polyimide resin plate was removed from the mold at room temperature.
The new foil has high bond strength with polyimide resin for high flexing endurance.
won the Commercial Invention of the Year Award for development of a thermosetting (permanently solidifying when heated) high-temperature polyimide resin system.
has appointed DuPont Vespel Parts and Shapes to be the exclusive distributor for Mitsui's Aurum thermoplastic polyimide resin in the U.
Unitech also markets RP46, a polyimide resin licensed from NASA that is capable of withstanding continuous temperatures of 700 F.
85NT is a polyimide resin system with a nonwoven aramid reinforcement that was originally developed to provide high Tg (240[degrees]C) and low X-Y CTE (6-9 ppm/[degrees]C) for reliable direct SMT applications involving leadless ceramic chip packages.
DuPont recently launched a thermoplastic polyimide resin, Vespel TP 8556.