So, no matter how many times solder is added to the joint, every time the PCB is run through the reflow
oven, the solder will drain away because the PCB, including the via, is at reflow
The solder paste reflow
process was satisfactory, and solder wetted the plating and formed what looked like a perfect solder joint that would have passed any inspection or AOI.
soldering system Creates the course is to be a replacement measure a new soldering system.
44) showed that manual thrombus aspiration before primary PCI led to lower risk of distal embolization, and no reflow
compared with standard primary PCI in the DEAR-MI (Dethrombosis to Enhance Acute Reperfusion in Myocardial Infarction) study.
This is a major milestone for the company, notably ensuring that the process is reflow
compatible and meets stringent quality standards", Jacky Perdrigeat, chief executive officer of Nemotek, told EE Times Europe .
004 inch), minimizing dry joints after solder reflow
and decreasing rework and scrap.
Effect of Reflow
Profile Parameters on Surface Mount Chip Resistor Solder Joint Shear Strength"
March 6, 2012 /PRNewswire/ --Gemini Fund Services, LLC (Gemini), an engaged partner to independent advisers as a provider of comprehensive, pooled investment solutions, has announced an agreement with ReFlow
Services, LLC (ReFlow
), a specialist in managing the impacts of shareholder flows, which gives all of Gemini's client fund managers access to ReFlow
's shareholder flow management tools.
temperatures are typically at least 13[degrees]C higher than melting temperatures, hence the SAC 305 peak temperature window of 233[degrees] to 255[degrees]C.
The defect possibly can be attributed to a chain reaction of events that begins as the assembly reaches reflow
Boyes brings to ReFlow
more than 15 years of experience in financial services, including senior-level positions at Clearstream Bank, PNC Global Investor Services, and Bank of New York.
PART OF THE reason vapor phase soldering technology is increasing in popularity is that Pb-free requirements and product miniaturization drive production issues not thoroughly addressed by conventional convection reflow