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single in-line package |
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See SIP. |
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| Applications include server and desktop computer motherboards, voltage regulator modules (VRM), video graphics cards and telecom single in-line package (SIP) modules. The new FCOSL packages are available in small outline integrated circuits (SOIC), thin shrink small outline package (TSSOP), single in-line package (SIP) and quad flat package (xQFP) configurations. The devices are offered in a wide selection of industry-standard packages as well as the UltraThin-Pak(TM), a low-profile, single in-line package, and the "power SO-8," which has three times more power dissipation than the standard SO-8 package. |
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