solder


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solder

(sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i.e., silver solders) have high melting points and are suited for use with ferrous and high-melting-point nonferrous alloys. Areas to be soldered are cleaned and coated with a flux (such as hydrochloric acid or borax) to prevent oxides from separating the solder from the surface. When brass is used in the solder or when brass surfaces are to be joined, the process is known as brazing, though the name is sometimes applied also to other hard soldering.

Solder

 

a metal or alloy that is introduced into the gap between combinable parts or that is formed between combinable parts as a result of diffusion during soldering. Solder has a lower melting point than soldered materials. The melting point of a solder is one of its most important characteristics and determines the soldering method and equipment to be used and the strength of the joint to be formed. The higher the melting point of a solder, the greater its strength and the strength of the soldered joint over the entire operational temperature range.

Solder must sufficiently wet the materials to be soldered and must flow over these materials in such a way as to cover all solderable gaps. Tight, corrosion-resistant joints are thus formed. Thermal expansion coefficients for both the solder and the soldered material should not differ markedly. In special cases, solders are required to be resistant to heat, acids, and alkalies. They should also be good electrical conductors.

The most common solders contain Sn, Pb, Cu, Ag, Ni, Zn, or Al. Monolithic, powdered, laminated, and self-fluxing solders are differentiated according to performance.

V. P. FROLOV

solder

[′säd·ər]
(metallurgy)
To join by means of solder.
An alloy, such as of zinc and copper, or of tin and lead, used when melted to join metallic surfaces.

solder

An alloy, usually having a lead or tin base, which is used to join metals by fusion; has a melting point which does not exceed 800°F (427°C).

solder

an alloy for joining two metal surfaces by melting the alloy so that it forms a thin layer between the surfaces. Soft solders are alloys of lead and tin; brazing solders are alloys of copper and zinc

solder

Pronounced "sod-er." A metal alloy used to bond other metals together. Tin and lead are used in "soft" solders, which melt rather easily. The more tin, the harder the solder, and the higher the temperature required. Copper and zinc are used in "hard" soldering, or brazing, which requires considerably more heat to melt. See braze, reflow and wave soldering.
References in periodicals archive ?
If you don't heat the joint enough, the solder won't flow into it.
For more information about NIST's lead-free solder activities, contact Carol Handwerker, chief of the Metallurgy Division and co-chair of NEMI's Alloy Group, (301) 975-6158, carol.
The board is positioned, checked with fiducials to make sure it's in place, and then the solder pot, with its pumped aperture, comes up and contacts all the solder sites at once, effectively making the solder joints, and then drops out of the way under programmed control.
3) and it is formed of a new intermetallic phase, which enhances the joint formation between the solder and A1.
The manual method usually starts with the application of a high viscosity flux (paste flux or "sticky" flux) to the solder balls or residual solder (if removed from a PCB) of the device.
Nitrogen may also help to improve ICT pin probeability of no-clean solder paste flux residues, which may be harder during higher temperature lead-free processing in air atmosphere.
Fill the joint until solder drips out, then move on to the next joint.
This is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used on the board to place the electronic components, after which heat is applied to melt the solder.
One method to examine separation between solder and pad on a BGA solder joint is the dye-and-pry technique.
The highest value of the ultimate strength of 196 MPa reached Zn-Al4 solder and the lowest Rm reached ZnAl1 solder.
These molecules of copper and tin that occur at the interface of the copper and solder are called intermetallics (FIGURE 3).
This is a process by which a molten bath of solder is formed into a fountain, over which the PCB passes.