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solder ball |
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solder ballIn BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. How to thank TFD for its existence? Tell a friend about us, add a link to this page, add the site to iGoogle, or visit webmaster's page for free fun content. |
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The development of this tiny probe signifies a breakthrough in the creation of optimal package design as it enables evaluation of electrical characteristics in packaging regions that could never before be reached such as near the solder ball of a BGA package, or the space among different chips in a system in package (SiP). It was also used in the solder balls of an array of packages. With package inspection forming a major step towards the production of fault-free packages, can the 3D inspection of the solder ball process help package manufacturers solve their solder analysis requirements? |
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