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solder ball

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solder ball
In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA.
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Pb-free solder balls require higher temperatures for reflow.
Anatomy of a correct thermal profile: complex, BGA-laden PCBs demand ... by Ilustre, Simon / Circuits Assembly
A type of memory chip with solder balls on the underside for mounting BGA stands for Ball Grid Array.
What Is BGA? by Althaf Ahmed / Computers and Internet community
[FIGURE 2a OMITTED] The first option is to reduce the solder ball pitch, which reduces the packages X-Y size.
A new approach for finer pitch package-on-package in mobile devices: ... by Sharma, Manisha / Printed Circuit Design & Fab
 
 
 
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