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solder bumping |
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solder bumpingA technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip. How to thank TFD for its existence? Tell a friend about us, add a link to this page, add the site to iGoogle, or visit webmaster's page for free fun content. |
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The inherent cost advantages, flexibility, and ease of use make SUSS production lithography systems extremely attractive solutions for different wafer level packaging technologies, including solder bumping, gold bumping, redistribution layers (for wafer level packages and chip stacking) or re-passivation. The hydrogen plasma reflow process eliminates the need for flux and produces void-free solder bumping and reliable attachment of flip chips," said Kok Whee Teo, vice president, global electronics market sector, BOC. Thick resist processing is an enabling technology for volume production in wafer level packaging and solder bumping, which represent the two main markets for both companies. |
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