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solder bumping

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solder bumping
A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip.
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NPL Report DEPC-MPR 031, August 2005) Solder Bumping "C4NP: Lead-Free and Low Cost Solder Bumping Technology for Flip Chip and WLCSP" Authors: Klaus Ruhmer, Eric Laine and Dr.
In case you missed it by Circuits Assembly
one of the world's largest semiconductor packaging and testing companies, has completed the development of its 300mm wafer solder bumping technology.
ASE DEVELOPS 300MM WAFER SOLDER BUMPING TECHNOLOGY by Electro Manufacturing
The ABA process decreases the size of Nextreme's thermal bumps to approximately 125 microns, which makes them flip-chip bumping compatible with standard solder bumping processes commonly used in electronics packaging.
Nextreme Pumps up with New Optocooler High Voltage Series by Business Wire
 
 
 
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