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system in package

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system in package
A complete system packaged in one housing. A system in package (SiP) contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate. A SiP is really a multichip module (MCM) that contains all the parts of a complete system. The SiP term was first used by Amkor Technology in the late 1990s and not trademarked in order to encourage its use worldwide. See SoC and MCM.

System In Package
This cross section of a SiP shows a microprocessor (µP), SRAM and flash memory chips packaged together in the same housing. The L,R,C stands for inductor, resistor, capacitor. (Image courtesy of Amkor Technology, Inc.)


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Technical coverage includes such topics as design for manufacturability (DFM); test and reliability (DFX); system in package (SiP), MCMs and 3-D packaging; integrated manufacturing and test; RF/microwave and high clock rate systems/sub-systems; optoelectronic, optical, MEMS and MEOMS packaging applications; and systems level energy and thermal management.
Its platform dramatically reduces the impact of noise when combining analog, RF and digital blocks in a single die or in a system in package (SiP).
This latest version of TPA introduces new automation, design flow and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging, including wirebond (WBBGA), flip-chip (FCBGA), chip-scale packages (CSPs) and System in Packages (SiP).
 
 
 
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