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tape automated bonding

   Also found in: Acronyms, Wikipedia 0.04 sec.

A process that places bare chips onto a printed circuit board (PCB) by attaching them to a polyimide film. The film is moved to the target location, and the leads are cut and soldered to the board. The bare chip is then encapsulated ("glob topped") with epoxy or plastic. See chip on board.

Tape Automated Bonding
After the chip leads are cut and soldered to the board, the chip is covered with a glob of epoxy or plastic. (Illustration courtesy of Joseph Fjelstad.)


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New PCB assembly technologies include tape automated bonding (TAB), chip on board (COB), multi-chip modules (MCMs) and ball grid array (BGA).
The services will include wirebonding, tape automated bonding (TAB) and flip chip for single chip, few chip and multichip packages.
These services include bar coding, bonded inventory, kitting, visual inspection, selected parametric or temperature probe, lot qualifications, burn-in, custom packaging and test, known-good die, tape automated bonding, and test program generation.
 
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