thermocompression bonding

thermocompression bonding

[¦thər·mō·kəm′presh·ən ′bänd·iŋ]
(engineering)
Use of a combination of heat and pressure to make connections, as when attaching beads to integrated-circuit chips; examples include wedge bonding and ball bonding.
References in periodicals archive ?
Given the forecast for narrow bump pitch ([less than or equal to] 100 [micro]m) and increased use of Cu pillar bumps, many companies plan to use thermocompression bonding (TCB).
The printed sealing frames can create airtight seals by densifying the structure with thermocompression bonding at 200 degrees Celsius.
Using pulsed heat technology, the Uniflow3 provides targeted heating and precision temperature control for flex circuits, ribbon cables, wires, SMT components, single or dual sided edge connectors and thermocompression bonding of gold ribbon.
In addition, thermocompression bonding techniques are utilized for wafor-to-wafer interconnects and stacking of all Si layers.
Unlike wirebonding, and while the packages are in the tape format, all the inner leads are bonded simultaneously to the chip by means of thermocompression bonding.
Today, at the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.
Printed sealing frames can create airtight seals by having a finer structure by thermocompression bonding at 200 degrees Celsius.
The instrument delivers targeted heating and temperature control for flex circuits, ribbon cables, wires, SMT components, single-or dual-sided edge connectors, and thermocompression bonding of gold ribbon via pulsed heat technology.
Other design features include components that are die attached with silver-filled conductive epoxy, interconnects made by thermocompression bonding of 1 mil diameter gold wire and a molding compound applied using dam and fill encapsulation of the component surface.