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underfill

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underfill [′ən·dər‚fil]
(metallurgy)
A depression on the face of the weld which falls below the surface of the adjacent base metal.

underfill
A depression, on the face of a weld, which extends below the surface of the adjacent base metal.


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Electromigration life was longer when underfill was used, and significant solder joint deformation toward the cathode occurred when underfill was not.
123-38A/B-187 is a thermally conductive underfill epoxy that strengthens the chip package and protects it from moisture.
No-flow underfill is a solution for enhancing the drop test performance of CSP solder joints, and has been adopted for portable devices.
 
 
 
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