The eWLB package is robust enough to be installed in front automotive module only protected by a plastic lid without underfill
is recommended to mitigate the increased risks of mixed alloy soldering of area array packages.
The Spectrum ll he is referring to enables consistent <200pm dots and solder paste line dispensing; features a tilt jetting capability for precision coating and underfill
in hard-to-reach places; and offers non-contact laser height sensors for detecting surface heights and allowing tight dispense gaps for thin dispense lines.
If the package has flip chip instead of wire bond, the die attach and wire bond will most likely be replaced by a pick-and-place system for mounting the flip-chip die on the substrate, underfill
dispense, and cure system.
123-38A/B-187 is a thermally conductive underfill
epoxy that strengthens the chip package and protects it from moisture.
is a solution for enhancing the drop test performance of CSP solder joints, and has been adopted for portable devices.
Through its use of safe and efficient x-ray technology, it adds a new dimension to the detection and rejection of containers with underfill
The NexJet System includes new precision software control of the jetting process, enabling successful results with both low- and high-viscosity fluids, and accommodates a broad range of fluids for applications such as flip chip underfill
, chip scale package, ball grid array, package-on-package underfill
, precise coating, and adhesive dispensing.
Physical Analysis - Physical Analysis Methodology - AMD Graphic Card Teardown - Graphic Card Opening - Package - View, Dimensions & Marking - Dies Size - DRAM Die - View, Dimensions & Marking - oBumps & TSVs - Logic Die - View, Dimensions & Marking - oBumps & TSVs - Cross-Section - Package Cross-Section - PCB & Frame Cross-Section - Interposer Cross-Section - GPU oBumps Cross-Section - HBM Stack Cross-Section (Side Mold, oBumps, Underfill
, TSV) - Comparison with Samsung 3D TSV DRAM stacking process 3.
ALTHOUGH YOU CAN'T see them, it's clear that voids or bubbles in underfill
materials can be a reliability problem.
A singular advantage of this approach is that it enables underfill
routines to be performed before placing the shield cans onto the PCB, rather than through perforations in the shield, as designs traditionally required.
Electromigration life was longer when underfill
was used, and significant solder joint deformation toward the cathode occurred when underfill