wedge bonding

wedge bonding

[′wej ‚bänd·iŋ]
(engineering)
A type of thermocompression bonding in which a wedge-shaped tool is used to press a small section of the lead wire onto the bonding pad of an integrated circuit.
References in periodicals archive ?
In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings.
Contract notice: Ultrasonic Wedge Bonding Machine and Data Traceability for battery Modules Manufacture CJ-08-16-AMPLiFII-WMG-ULTRABOND-RK.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products.
Hesse and Knipps emphasized low loop wedge bonding for thin packages in one of the few wire-bond presentations.
Wedge bonding is a specific type of wire bonding that uses a wedge-shaped tool to create the welds.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices, as well as epoxy, laser weld and solder based attachment of actively aligned photonic devices.
A raw or unpackaged silicon chip is mounted directly on to a metallic heat sink using an adhesive and is then attached to the flex circuit using aluminium wedge bonding.
He reports similar success with aluminum wedge bonding.
4 mil square, forcing round wire wedge bonding to be accomplished with 0.
Where cost sensitivity is acute, either OSP over copper for solder-ability with selective nickel or gold plating on the bond sites, or simply a uniform nickel as a common soldering and bond site finish together with aluminum wedge bonding, provides the lowest-cost alternative.
The tests involved manual and automatic ultrasonic 25 [[micro]meter] Au wire wedge bonding (tests one and two), manual thermosonic 25 and 38 [[micro]meter] Au wire ball bonding (tests three and four), automatic thermosonic 25 [[micro]meter] Au wire ball bonding (test five) and semi-automatic thermocompression 25 [[micro]meter] Au wire wedge bonding (test six).
The technical publication titled "Large Cu Wire Wedge Bonding on Wafers with Cu Pad Metallization" was written in collaboration with Atotech Deutschland.