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wedge bonding

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wedge bonding [′wej ‚bänd·iŋ]
(engineering)
A type of thermocompression bonding in which a wedge-shaped tool is used to press a small section of the lead wire onto the bonding pad of an integrated circuit.


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Wedge bonding is a specific type of wire bonding that uses a wedge-shaped tool to create the welds.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices, as well as epoxy, laser weld and solder based attachment of actively aligned photonic devices.
In recent years K&S has expanded its product offerings through strategic acquisitions, adding die bonding, wedge bonding and a broader range of expendable tools to its core ball bonding products.
 
 
 
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