wedge bonding

wedge bonding

[′wej ‚bänd·iŋ]
(engineering)
A type of thermocompression bonding in which a wedge-shaped tool is used to press a small section of the lead wire onto the bonding pad of an integrated circuit.
References in periodicals archive ?
This session track covers non-destructive testing challenges and methods of wires and bond pads, Pd-coated Cu wire process window optimization, Cu wedge bonding, Al and Ag based wires as alternatives to copper, plus hybrid wire bond capabilities.
In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products.
Hesse and Knipps emphasized low loop wedge bonding for thin packages in one of the few wire-bond presentations.
Wedge bonding is a specific type of wire bonding that uses a wedge-shaped tool to create the welds.
Processes include high accuracy component assembly with eutectic solder or epoxy, precision ball bonding, and wedge bonding for fine pitch devices, as well as epoxy, laser weld and solder based attachment of actively aligned photonic devices.
He reports similar success with aluminum wedge bonding.
Where cost sensitivity is acute, either OSP over copper for solder-ability with selective nickel or gold plating on the bond sites, or simply a uniform nickel as a common soldering and bond site finish together with aluminum wedge bonding, provides the lowest-cost alternative.
The technical publication titled "Large Cu Wire Wedge Bonding on Wafers with Cu Pad Metallization" was written in collaboration with Atotech Deutschland.
Wedge bonding tools must be ground to very narrow profiles for fine pitch capability, but their profiles can reduce loop height, an important consideration for low profile applications.
In recent years K&S has expanded its product offerings through strategic acquisitions, adding die bonding, wedge bonding and a broader range of expendable tools to its core ball bonding products.
These statements are "forward-looking" statements within the meaning of the Private Securities Litigation Reform Act of 1995, and include, but are not limited to, statements that relate to increasing demand for ball bonders, the continuing semiconductor industry recovery, increasing demand for ball bonder products from the conversion to copper wire bonding and penetration of the LED market, continuing, accelerating demand for heavy wire wedge bonding products, future revenue, sales, demand for our products and product development.
Our wedge bonder business saw an increase in customer activity during the June quarter, with sales of wedge bonding tools up significantly and customer interest in wedge bonder equipment increasing.