wire bond

wire bond

The use of tiny wires that are soldered to the bare die on one end and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package.


Wire Bond Vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps. (Image courtesy of Amkor Technology, Inc.)
References in periodicals archive ?
The majority of TI's existing analog and CMOS silicon technology nodes have been qualified with copper, and all new TI technologies and packages are being developed with copper wire bond.
Nordson MARCH, a Nordson company and global leader in plasma processing technology, announces that the white paper, Plasma Clean to Reduce Wire Bond Failures, is now available on the Nordson MARCH website.
In the "as plated" condition, there is no observable difference in the wire bond reliability performance of phos palladium vs.
He reviews wire bond failure modes and mechanisms (mechanical, metallurgical, chemical, etc.
If the package has flip chip instead of wire bond, the die attach and wire bond will most likely be replaced by a pick-and-place system for mounting the flip-chip die on the substrate, underfill dispense, and cure system.
Presentation to Highlight Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for High Performance Multi-Chip Packaging
This session track covers non-destructive testing challenges and methods of wires and bond pads, Pd-coated Cu wire process window optimization, Cu wedge bonding, Al and Ag based wires as alternatives to copper, plus hybrid wire bond capabilities.
Contract awarded for obtaining wire bond a braid no.
At the next price point, Figure 9 shows the COB in a PDA using a multilayer FR-4 PCB with uniform nickel metalization at both soldering and wire bond sites with AlSi wire bonding process.
Since the initial opening of Palomar Asia, the office has generated substantial business growth year-after-year and quickly became recognized for its superior support of Asia-Pacific customers requiring automated wire bond and die attach equipment.
The bottom-side of the metal leadframe is patterned to isolate the chippad, and the wire bond contacts only after the front side, including the chip and wires, is encapsulated.
Amkor has successfully delivered high performance packages with excellent reliability at competitive copper wire bond price points for our low cost Cyclone IV FPGA family.