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wire bond

   Also found in: Wikipedia 0.03 sec.

The use of tiny wires that are soldered to the bare die on one end and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package.

Wire Bond Vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps. (Image courtesy of Amkor Technology, Inc.)
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However, peroxide cured NR compounds without sulfur in which silica was the only potential source of adhesion showed no improvement in brass wire bond strengths when silica content was raised to 20 and 40 phr (table 1).
Mechanism of brass adhesion by Hewitt, N.L. / Rubber World
is a world-class supplier of electronic interconnect solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging, as well as precision equipment manufacturing and integration.
Endicott Interconnect Technologies Places Multiple-System Order for ... by Business Wire
He has delivered papers on wire bond encapsulation, chip scale package/flip chip assembly, PCB design rules, and reliability at numerous technical meetings and conferences, and has had papers published in many global industry publications.
Asymtek's Steven Adamson Elected IMAPS President Elect for 2007 by Business Wire
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