wire bond

wire bond

The use of tiny wires that are soldered to the bare die on one end and to metal leads of the chip package on the other. Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package.


Wire Bond Vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps. (Image courtesy of Amkor Technology, Inc.)
References in periodicals archive ?
Nordson MARCH, a Nordson company and global leader in plasma processing technology, announces that the white paper, Plasma Clean to Reduce Wire Bond Failures, is now available on the Nordson MARCH website.
3) Broken or missing wire bonds A broken wire bond may be a result of extreme mechanical or thermal stress applied to the part.
In the "as plated" condition, there is no observable difference in the wire bond reliability performance of phos palladium vs.
He reviews wire bond failure modes and mechanisms (mechanical, metallurgical, chemical, etc.
If the package has flip chip instead of wire bond, the die attach and wire bond will most likely be replaced by a pick-and-place system for mounting the flip-chip die on the substrate, underfill dispense, and cure system.
For example, a wire bond between a MMIC and its module circuit behaves as a parasitic inductance.
Presentation to Highlight Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for High Performance Multi-Chip Packaging
Contract awarded for obtaining wire bond a braid no.
Traditional LEDs use a wire bond to create an electrical pathway at the PN junction.
At the next price point, Figure 9 shows the COB in a PDA using a multilayer FR-4 PCB with uniform nickel metalization at both soldering and wire bond sites with AlSi wire bonding process.
The high conductivity and wire bond characteristics of thick-film gold pastes meet many of these requirements.
The bottom-side of the metal leadframe is patterned to isolate the chippad, and the wire bond contacts only after the front side, including the chip and wires, is encapsulated.