wire bonding


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wire bonding

[′wīr ‚bänd·iŋ]
(electricity)
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
(electronics)
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.
References in periodicals archive ?
14, 2014 /PRNewswire/ -- Texas Instruments (TI) (NASDAQ: TXN) today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.
The article discusses the two areas of wire bonding, the wire bonding process itself (wire bond statistics ) and the long-term reliability of the device.
Successful gold wire bonding is achieved between a gold wire and a clean soft gold surface finish.
Industry executives pointed out that both the company's 2010 net income and EPS results topped expectations mostly thanks to increased contracts from integrated device manufacturers (IDMs), surged contracts for its copper wire bonding service, and its merger with Universal Scientific Industrial Co.
In this update of the 1997 and 1989 editions, Harman (retired, Fellow of the National Institute of Standards and Technology) presents new material based on recent technical areas and technologies in the field of wire bonding and frequently asked questions.
Within mainstream surface mount assembly, bare die wire bonding directly to the PCB substrate and adjacent to other soldered components has long been practiced for low end to high performance assemblies.
Typical uses for the 8000 will be wire bonding for microelectronic packaging including most semiconductor-based interconnect applications.
Aerosol Jet Systems' fine line printing capabilities enable significant pitch reductions, thereby increasing interconnect densities and affording greater semiconductor packaging functionality at a competitive cost with wire bonding and at a fraction of the cost of TSV technology.
Wire Bonding & Stud Bumping Technical Track Dan Evans (Palomar Technologies Senior Scientist) and Lee Levine (Process Solutions Consulting) will co-chair the Wire Bonding and Stud Bumping technical track.
Objective: To determine the thickness of Pd in ENEPIG for soldering and wire bonding applications.
Taipei, June 21, 2010 (CENS) -- Swarming contracts from over 200 customers for copper wire bonding services are estimated to bring in Advanced Semiconductor Engineering Inc.
The design reportedly makes the lead-frame mechanically rigid and thermally robust, eliminating distortion and deformation during chip attach and wire bonding.