wire saw


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wire saw:

see quarryingquarrying,
open, or surface, excavation of rock used for various purposes, including construction, ornamentation, road building, and as an industrial raw material. Rock that has been quarried is commonly called stone.
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wire saw

[′wīr ′sȯ]
(mechanical engineering)
A machine employing one- or three-strand wire cable, up to 16,000 feet (4900 meters) long, running over a pulley as a belt; used in quarries to cut rock by abrasion.

wire saw

An assembly for sawing stone by a rapidly moving continuous wire that carries a slurry of sand or other abrasive material.
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References in periodicals archive ?
By chance, he bumped into one of his former patients, the same farmer he had operated on with the wire saw four years before.
Wire saw machining technologies have advanced significantly in the past decade due to the needs for precision slicing of silicon wafers in semiconductor manufacturing.
Tenders are invited for Supply of one diamond wire saw machine.
Ihsanullah said that PASDEC is endeavoring mechanized quarrying practices in the country that include diamond wire saw, chainsaw machines for precise cutting and bench quarrying.
PASDEC is endeavouring mechanized quarrying practices that include diamond wire saw, chain saw machines for precision and cutting and bench quarrying.
Detailed 12 technologies relating to low-cost wafer manufacturing technology trend (Mono like multi, Diamond wire saw and so on.
Valtech's epoxy adhesive systems exceed the performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes.
The introduction of the PolyMax high volume manufacturing system brings the industry one step closer to replacing wire saw processes with a lower cost waste-free wafering solution.
Advanced Wire Saw Technology for Increased Productivity and Performance
Solarfun" or "the Company") (Nasdaq: SOLF), a vertically integrated manufacturer of silicon ingots, wafers and photovoltaic ("PV") cells and modules in China, today announced that it has already reached its 2010 year-end target of 360 MW in ingot manufacturing capacity, 400 MW in wire saw capacity, 500 MW of cell capacity and 900 MW in module capacity.
The first wire saw for the slicing of ingots into wafers has also now been
Pakistan Machine Tool Factory (PMTF) Engineers Succeeded in Producing Latest Diamond Wire Saw Cutting Machine.