Hybrid Memory Cube

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Hybrid Memory Cube

A memory module technology from the Hybrid Memory Cube Consortium (HMCC), spearheaded by Micron and Samsung, that stacks chips vertically rather than horizontally. Finalized in 2013, Hybrid Memory Cubes (HMCs) provide 15 times the bandwidth of DDR3 chips while consuming 70% less power and 90% less space. Like DRAM, HMCs lose their content without power.

Initially used in supercomputers and high-speed servers, HMC memory is expected to migrate to all types of computing devices. See dynamic RAM, memory module and via.


3D Stacking
DRAM layers are stacked over a logic layer and connected with "vias" (corner cutout) that run through the silicon. This compact architecture is faster and more energy efficient than conventional DRAM modules. (Image courtesy of the HMC Consortium, www.hybridmemorycube.org)
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References in periodicals archive ?
Samsung's sixth-generation V-NAND features the industry's fastest data transfer rate, capitalizing on the company's distinct manufacturing edge that is taking 3D memory to new heights.
ENPNewswire-August 7, 2019--Samsung Electronics Takes 3D Memory to New Heights with Sixth-Generation V-NAND SSDs for Client Computing
Toshiba is currently migrating all client, data center and enterprise SSDs to the newest BiCS FLASH 64-layer 3D memory. This migration sets Toshiba up for extending their recent recognition by IDC as the fastest growing storage device vendor in the $17 billion solid state drive (SSD) segment for 20166.
"Also, in using our 3D memory technology here, we can more proactively cope
Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market."
Technological advances such as high storage capacity and less power consumption are increasing the adoption of 3D NAND and DDR4 DRAM in smartphones, tablet PCs, consumer electronics, and automotive products, thereby driving the growth of the 3D memory chips.
This note reports on the feasibility of a novel 3D memory consisting of a high-speed silicon short-term cache memory and a long-term high density MO memory.
ENPNewswire-August 6, 2019--Samsung Electronics Takes 3D Memory to New Heights with Sixth-Generation V-NAND SSDs for Client Computing