Latest 3D memory
models for DDR4-3DS, HMC, HBM and Wide I/O 2
events, universities and organizations around the world, producing custom lines of 3D Memory
Shadow Boxes, blown glass and reverse painted ornaments, specializing in detailed poly resin Sculptures and Figurines.
NASDAQ: CDNS) said it has announced the availability of verification IP supporting all popular 3D memory
standards including Wide I/O 2, Hybrid Memory Cube, High Bandwidth Memory and DDR4 3D Stacking.
Nanoelectronics research center imec and Excico, a global leader in semiconductor laser annealing, have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory
This note reports on the feasibility of a novel 3D memory
consisting of a high-speed silicon short-term cache memory and a long-term high density MO memory.
Other SEMATECH papers will showcase advances in metrology techniques, photoresist shrinkage, nanopolishing, scatterometry, through-silicon via (TSV) reveal, transmission electron microscopy (TEM) tomography, critical dimension atomic force microscopy (CD-AFM), critical dimension X-ray scattering (CD-SAXS)--a potential metrology technique for FinFET and 3D memory
structures--and a through-focus scanning optical microscopy (TSOM) technique being explored for future defect inspection or to enable high-volume manufacturing of high-aspect ratio features.
The demo will highlight future and potential capabilities and showcase a high-performance, low-power 3D memory
system using a double-sided IC package.
and will focus on the high density demands of the storage market, as well as the keys to making competitive 3D memory
storage solutions a reality.
We believe that Ziptronix's patented direct bonding technology enables the industry's best performance for applications such as 3D memory
, BSI image sensors and a developing host of other applications," said Dan Donabedian, CEO of Ziptronix.
As the industry demands new materials to meet the needs of EUV lithography, 3D memory
, power ICs, image sensors, TSV and MEMS applications, Pibond is well placed to be a driving force in this transition.
Dan Donabedian, CEO of Ziptronix, said: "We believe that Ziptronix's patented direct bonding technology enables the industry's best performance for 3D memory
NASDAQ: CDNS), a leader in global electronic design innovation, today announced the immediate availability of verification IP (VIP) supporting all popular 3D memory
standards including Wide I/O 2, Hybrid Memory Cube (HMC), High Bandwidth Memory (HBM) and DDR4 3D Stacking (DDR4-3DS).