Auger electron


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Auger electron

[ō′zhā i′lek‚trän]
(atomic physics)
An electron that is expelled from an atom in the Auger effect.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive ?
The samples surfaces were analyzed by Auger Electron Spectroscopy for the chemical composition of the material and its hardness values are reported here.
X-ray Excited Auger Electron Spectroscopy (XAES), on the other hand, seems to play a better role in the analysis of electronic structure, allowing more precise interpretations of the fine structure of the spectra.
where [[lambda].sub.P] ([E.sub.P]) is the mean-free path of an Auger electron of energy [E.sub.P] in the matrix; [a.sub.P], [r.sub.P], and [r.sub.M] are terms describing the backscattering, [theta] is emission angle with respect to the specimen surface normal, and [I.sup.[infinity].sub.P] and [I.sup.[infinity].sub.M] are pure elements signal intensities specified in [20].
Hernandez et al., "ErbB-2 blockade and prenyltransferase inhibition alter epidermal growth factor and epidermal growth factor receptor trafficking and enhance 111In-DTPA-hEGF auger electron radiation therapy," Journal of Nuclear Medicine, vol.
More importantly, by studying the thermal stability of the Ba overlayer on the Ni(110) surface, we demonstrate the sensitivity of the low energy Auger electron spectrum to the overlayer order.
Auger electron spectroscopy (AES) is a surface sensitive analysis method for determining the elemental composition of solid materials.
Phosphors was often detected on the surface of the particles remaining after partial dissolution at 700[degrees]C, in examination by Auger electron spectroscopy.
This resource for researchers describes the application of scanning Auger electron microscopy to the surfaces of semiconducting device structures and to systems in materials science.
The results of atomic force microscopy (AFM), scanning electron microscopy (SEM), and auger electron spectroscopy (AES) analyses reveal that the [Al.sub.2][O.sub.3] films perfectly adhere to the substrate through the buffer layer, no visible defects were observed, and no impurity from Ni or Cu was detected.
Other methods such as optical emission spectroscopy (OES), energy-dispersive x-ray spectroscopy (EDS), x-ray photoelectron spectroscopy (XPS) and auger electron spectroscopy (AES) can also help identify solder compositions.
The company provides analytical services including EPMA, Auger electron spectroscopy surface analysis, metallography and optical microscopy.