BGA


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BGA

Ball Grid Array

BGA

(Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. BGA chips are easier to align to the printed circuit board, because the leads, which are called "solder balls" or "solder bumps," are farther apart than leaded packages. Since the leads are underneath the chip, BGA has led the way to chip scale packaging (CSP) where the package is not more than 1.2x the size of the semiconductor die itself. See surface mount, chip package, MicroBGA and flip chip.


BGA Solder Balls
These are the undersides of BGA packages showing the solder balls. The small one on the ruler is a µBGA (MicroBGA) chip from Tessera. Using the entire square of the chip package for leads is an advantage of the BGA method. (Image samples courtesy of Amkor Technology, Inc.)







BGA Package Types
These cross sections show BGA packages in standard and CSP varieties. (Illustrations courtesy of Joseph Fjelstad.)








Different Contact Types
The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustrations courtesy of Joseph Fjelstad.)


Different Contact Types
The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustrations courtesy of Joseph Fjelstad.)
References in periodicals archive ?
In the banks, the BGA will serve variously as consultant, back-room resource, administrator, and even trainer.
The advisory prompted calls from consumers of UKL BGA products, who expressed concern about the possible contamination of these products with microcystin toxins.
Using 10 psi of contact pressure during application ensures a strong bond between the heat sink and the BGA, especially with Amkor/Anam's SuperBGA(R).
Process optimization eliminates the need for bump inspection, and underfill improves the reliability of the BGA attachment by providing stress relief during thermal and mechanical environments.
State-of-the-art BGA packaging now has become the low-cost method-of-choice for high-density devices over fine-pitch (wire diameter)leaded packages.
In its role, BGA assembled documents for the architectural portion of the project, which included the installation of demountable, exterior flood barriers around the perimeter of 2 Broadway.
BGA officials added that imports were likely to rise by 4 percent in the same period, reaching 947 billion euros.
On the other hand, more heat needs to be applied to the larger BGA packages for solid solder joints and to keep from creating open solder joints.
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The distribution engine driving independent life insurance sales is the BGA. This form of distribution has evolved over the last several years, and today's successful BGA is a model in effectiveness and productivity.
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