Bakeout

bakeout

[′bāk‚au̇t]
(engineering)
The degassing of surfaces of a vacuum system by heating during the pumping process.

Bakeout

A technique for reducing the exposure of occupants to emissions of new construction. The building temperature is raised to a high level, generally around 100 degrees to enhance emissions of volatile compounds from furniture and new materials for several days before occupancy, using 100 percent outside air to exhaust the emissions.
References in periodicals archive ?
Thermoelectric quartz crystal micro-balance - Thermal vacuum bakeout
It features up to three set point relays, a high bakeout temperature of 100 C and a reduced process cycle time because of the sensor's fast, accurate and repeatable pressure measurements.
Miyachi Unitek has announced its SA2200 stand-alone vacuum bakeout oven, for adding bakeout capacity independent from an atmospheric enclosure.
There are, generally, three conventional treatment methods used to clean, scour or fully-react silicone substrates, respectively, and these include solvent extraction, thermal vacuum bakeout and enhanced silicone curing processes
Fortunately, if undercured mask creates wave-soldering issues, frequently they can be remedied by simply completing the cure cycle - either in a bakeout step or by exposure to ultraviolet light, depending on the type of mask on the PWB.
The ultimate pressure of less than <[10.sup.-6] Pa takes several days, but can be achieved faster by the use of available in-vacuum bakeout lamps if necessary.
It provides complete process diagnostics and alarm displays, as well as adaptive wet heater bakeout, and is available in 3- and 30-amp modules.
An investigation into the effect of "building bakeout" conditions on building materials and furnishings.
This design provides a number of convenient benefits, including the ability to remove the motor during bakeout, or any other time, without risking the loss of vacuum.
Through this period of growth, plastics had the advantages of broader bonding alternatives, better thermal shock and corrosion-resistance properties and less stringent bakeout requirements.
D is the downtime given by, (3) D = TTOC/(TTOC + TTA) TTOC, typical time to return the machine from atmospheric pressure to operating conduction, includes the time it takes to perform effusion cell recharging, maintenance, pump-down, bakeout and effusion cell conditioning.
This higher temperature, combined with a heated quadrupole and automated bakeout cycle, delivers superior analytical performance while requiring minimal maintenance, even with dirty samples.