wire bonding

(redirected from Bond wire)

wire bonding

[′wīr ‚bänd·iŋ]
(electricity)
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
(electronics)
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.
References in periodicals archive ?
It is even possible to perform a pattern recognition step between each bond wire.
The technology itself provides a simple technique for a wide variety of high-magnification X-ray applications to analyze such defects as fine bond wire cracks or tiny voids that occur in flip chip solder balls of merely 25 microns in diameter and display at this extremely high resolution.
Tenders are invited for Pin Channel Single Groove 7Mm Dia For 4Mm Dia Bond Wire Rdso Specification No: S-17-75
Once the signal leaves the chip, the propagation (and reflection) is effected by discontinuities at the RDL layer or I/O pad where the signal enters a BGA or bond wire.
Applications for the xs series nf tube will be in analyzing of defects such as fine bond wire cracks (pictured--a 25 micron bond wire thermically damaged by overcurrent) or tiny voids that occur in flip-chip solder balls that are 25 microns in diameter.
These include the transistor model (FET2 and MET), with package, bond wire, and internal matching network effects.
To calculate the power to ground inductance, the 3-D power and ground connections in the package, including the bond wire, substrate metal and stacking pins were modeled (Figure 4).
Zuken announced the development of a 3D package synthesiser that allows designers to place multiple die and check bond wire configurations in 3D for stacked die integrated circuit (IC) packages.
Other key benefits of the LFGA package are its shorter bond wire lengths compared to standard QFN packaging which not only helps improve the electrical performance, but also helps to reduce material costs.
In applications such as this, the extremely precise die position relative to other die in the assembly defines an accurate bond wire length (and therefore resistance) and capacitance and inductance (wire loop control) that can become a predictable and reliable part of the RF design.
Tenders are invited for Hand Operated Track Drilling Machine For Drilling Bond Wire Holes Of Size 9/32 Inch In Railway Track Suitable For 52 Kg Or 60 Kg Rails.