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Designed to deliver excellent performance with multiple substrates, from extreme temperatures to high vibration, Loctite HY 4090 and Loctite HY 4080 GY Universal Structural Bonders greatly expand the capabilities of traditional adhesives and offer versatile solutions for challenging applications.
Panasonic has outfitted the site with an FCX501 gold-to-gold ultrasonic bonder, PSX303 inline plasma cleaner, HW27 wire bonder, FCB3 multipurpose bonder, and an IPAC-CS module chip mounter.
Specifically, SUSS MicroTec has supplied IMEC with a FC150 Automated Device Bonder to perform all bonding tests realized in the frame of this one-year research program.
Krauss-Maffei also showed its DVD hot-melt bonder with a 3.
Nearly every aspect of all other variables in wire bonders has been scrutinized for reduction in cycle time.
ConnX Plus is a second generation ball bonder under the successful Power Series (TM).
Offering performance and versatility, Loctite Universal Structural Bonders greatly expand the capabilities of traditional adhesives.
Expensive automatic bonders have pattern recognition systems that look at the chip while it is sitting in the carrier, memorize the emission point's location and coordinate that with the landing site on the submount.
Palomar Technologies' Model 6500-Wafer Scale Packaging (WSP) Eutectic Die Bonder enables very high density packaging at wafer scale, using its proprietary Pulsed Heated tool positioned with 0.
With the trend for 200mm MEMS manufacturers to move to MEMS foundries utilizing advanced metal bond technologies we are very pleased to be accepted as the supplier of choice for bonders to help MEMS manufacturers achieve significant size and cost reduction for their devices" said Wilfried Bair, General Manager of the bonder division, SUSS MicroTec, "We see MST.
said Wilfried Bair, VP Business Development and General Manager, Bonder Division, "It shows our customers that we are producing leading-edge and top quality wafer processing equipment covering all steps from design and development, to manufacturing, installation and after-sales support.
SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of process and test solutions for the semiconductor industry, announces the CB Series, semi and fully automated wafer bonders, for Advanced MEMS devices for the automotive and consumer markets.