XJTAG delivers a diverse range of boundary scan test
solutions for clients across a wide range of industries, including aerospace, automotive, defence, medical, manufacturing, networking, and telecommunications.
The key is how to put a process in place in the PCBA production cycle to ensure the possibility of a non-working or unstable boundary scan test
is minimized or completely eliminated during production testing.
Keysight Technologies announced in March that SSP has achieved significant boundary scan test
capabilities using the Keysight x1149 boundary scan analyzer in a standalone configuration or integrated with the Keysight i3070ICT system.
The TAP controller state diagram shows the sequence of any boundary scan test
through the TAP controller, and applies to components that comply with IEEE 1149.
The boundary scan test
technology present in the PCBA is to increase test coverage of the components' early manufacturing defects (shorts/opens); complex PCBAs with masked vias tend to have limited test access points.
The cells are linked together such that the tests executed during a boundary scan test
do not need to pass through the core logic of the IC.
Designed specifically for Teradyne by JTAG, the solution with an advanced boundary scan test
option is for manufacturers using the company's TestStation and GR228X family of In-Circuit Test systems, it said and added that two implementations of Symphony are supported by this collaboration for highest production test flexibility.
Boundary scan interconnect and buswire test: Boundary scan test
for interconnect pins between boundary scan devices.
Boundary scan requires the IC designer to dedicate four or five physical pins, 200 gates of silicon and write boundary scan test
code for the IC.
Below are the following IEEE standards and boundary scan test
system features that enable test engineers to recover manufacturing test (FIGURE 2):