CSP BGA | Article about CSP BGA by The Free Dictionary
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CSP BGA(Chip Scale Packaging Ball Grid Array) A BGA chip package that is not much larger than the chip itself. See MicroBGA, BGA and CSP.
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TABLE III ONE-METAL CSP BGA PACKAGE TRACE PARAMETERS (PER mm) [L.sub.self] (nH) 0.520 [L.sub.m] [+ or -] (nH) 0.258 [C.sub.total] (fF) 109 [C.sub.p] (fF) 16 [C.sub.sidex2] (fF) 88 [([L.sub.self]/[C.sub.total]).sup.0.5]([Omega] 69 [C.sub.total] = [C.sub.p] (parallel plate capacitance) + [C.sub.sidex2] ([long side of lead] x 2) + [C.sub.fringe] (not shown on table) [L.sub.self] = self-inductance of a trace surrounded by four traces per side [L.sub.m[+ or -]1] = mutual inductance with respect to the center trace (only one coupling pair is shown) SIMULATION CASE STUDY
Electrical attributes of single- and double-metal CSP BGA packages were characterized.