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These enhanced BGA packages provide low-cost alternatives to the more traditional thermally enhanced ceramic pin grid array (PGA) packages.
The AMD-K6-2E processor is packaged in a Socket 7 and Super7(tm) platform-compatible, 321-pin ceramic pin grid array (CPGA) package using C4 flip-chip interconnection technology.
The processors are available in an industry-standard, Socket 7 and Super7(TM) platform-compatible, 321-pin ceramic pin grid array (CPGA) package.