It is used in several packaging techniques which include ball grid array, chip scale packaging
, flip chip, and others.
The product is in the form of chip scale packaging
and is expected to be helpful for various backlighting applications worldwide.
According to STATS ChipPAC the new 197,000 sq ft building will be located next to its current factory in Yishun, Singapore and will enable the company to expand its manufacturing capabilities for advanced wafer level technologies including embedded Wafer Level Ball Grid Array (eWLB), Wafer Level Chip Scale Packaging
(WLCSP), Integrated Passive Devices (IPD) and Through Silicon Via (TSV).
of Singapore, a globally leading provider of chip packaging and test services, yesterday inaugurated a facility at its Taiwan subsidiary to deal with 300mm wafer bump and wafer level chip scale packaging
The SiI 9020 is the first discrete HDMI transmitter designed specifically for the mobile/portable market, with reduced power consumption and chip scale packaging
to meet the demands of highly integrated digital cameras and camcorders.
Unitive opened a new Die Level Processing (DLP) facility in the United States representing the industry's most advanced turnkey chip scale packaging
Furthermore, Flip Chip forms the basis of more aggressive miniaturization methods, such as three-dimensional chip scale packaging
All image processors are in chip scale packaging
. In 10,000 unit quantities, the LM9704 is priced at $9.10, the LM9702 is $6.50 and the LM9701 is $7.80.
It utilizes chip scale packaging
technology to realize a frequency range of 1173 to 1943 MHz with a step size of 1000 kHz It offers a phase noise specification of--96 dBc at 10 kHz offset and -120 dBc at 100 kHz offset or, equivalently, a BMS phase error of 2.1' integrated over 100 Hz to 100 kHz.
Producers are quickly moving toward wafer-scale integration and increasing use of flip chip, ball grid array and chip scale packaging
Therefore, the strong demand for 65/55-nanometer and below wafer manufacturing has prompted testing and packaging companies to expand their capacity to fill orders from upstream manufacturers for wafer bumping, WLCSP (wafer level chip scale packaging
) and mixed-signal integrated circuit and high-speed logic circuit testing.