chip carrier

(redirected from Chip carriers)

chip carrier

(1) The package that a chip is mounted in. See chip package.

(2) A chip package with connectors on all sides. See leaded chip carrier and leadless chip carrier.


An Old Chip Package
Chips like this old Motorola 6801 microcontroller used to be packaged in a housing with pins that plugged into a circuit board. Today most chips are soldered on top of the board (see QFP and BGA).
References in periodicals archive ?
Tenders invited for Supply of Multi pin chip carriers
In a break with the planar paradigm of silicon mounted on chip carriers mounted on printed circuit boards, Wong's "Organic Fab" integrates components and interconnects in a large area organic substrate, combining the "better than book" potential of SiP packaging with the economies of printed circuit production.
rex 541 for use by customers who extrude sheets and films that can be thermoformed to finished components, saying that it is "ideal for applications in several industries": medical--for use in sterilizable trays and equipment; aerospace--meets flame, smoke and toxicity requirements for use in aircraft interior applications; and semiconductor--provides high stiffness and a low coefficient of thermal expansion for use in chip carriers.
In 2009, H&V launched Viamat, a nonwoven aramid paper which is used as a core substrate in printed circuit boards and flip chip carriers.
A grade of DSM's Stanyl nylon 46 has been introduced for lead chip carriers for high brightness LEDs such as found in back lighting LCD display panels for mobile phones, PDAs, notebook PCs and hand held devices.
is aimed at high-brightness LEDS used in chip carriers for mobile phones, PDAs, and notebook PCs.
3-D interconnection ceramic chip carriers from Microcertec S.
DSM Engineering Plastics has announced the launch of Stanyl LED (light emitting diodes) 1551, the latest grade of Stanyl used in plastic lead chip carriers (PLCC) for high-brightness LEDs.
2] were joined to organic buildup chip carriers and subjected to a battery of tests.
ASAT's advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip.
Due to the flat back face of the chip carriers, the packaged MMICs are real surface-mount devices and, thus, require only a- flat printed circuit board (PCB) without any cutouts or special modifications.
Figure 1 shows results from the US Air Force's highly accelerated stress testing on bare die in leaded chip carriers, illustrating the high failure rate of standard plastic-encapsulated microcircuits, as compared to devices protected by ChipSeal.