Dual In-Line Package

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Related to Dual In-Line Package: dual inline package switch, Surface mount technology

dual in-line package

[¦dü·əl ¦in ‚līn ′pak·ij]
Microcircuit package with two rows of seven vertical leads that are easily inserted into an etched circuit board. Abbreviated DIP.

Dual In-Line Package

(DIL, DIP) The most common type of package for small and medium scale integrated circuits, with up to about 48 pins. The pins hang vertically from the two long edges of the rectangular package, spaced at intervals of 0.1 inch. The pins fit through holes in the circuit board to which they are soldered or into a socket.

References in periodicals archive ?
* DIP (dual in-line package) switches are gone forever!
Areas examined include pad to pad, lead to lead and entrapment effects on component styles such as ball grid array (BGA), leadless chip carrier (LCC), quad flat pack (QFP), dual in-line package (DIP), pin grid array (PGA), 1206 chip, 0805 chip and comb patterns (B24, Bellcore).
What about the dual in-line package (DIP) settings on your external modem and your printer?