Dual In-Line Package

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dual in-line package

[¦dü·əl ¦in ‚līn ′pak·ij]
Microcircuit package with two rows of seven vertical leads that are easily inserted into an etched circuit board. Abbreviated DIP.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.

Dual In-Line Package

(DIL, DIP) The most common type of package for small and medium scale integrated circuits, with up to about 48 pins. The pins hang vertically from the two long edges of the rectangular package, spaced at intervals of 0.1 inch. The pins fit through holes in the circuit board to which they are soldered or into a socket.

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(1) See device independent pixel.

(2) (Document Image Processing) See document imaging.

(3) (Dual In-line Package) A common, mostly-rectangular chip housing with leads (pins) on both sides. Tiny wires of a DIP bond the chip to metal leads that wind their way down into spider-like feet. The DIP is either plugged into a socket or inserted into holes in the printed circuit board and soldered. See DIP switch, CDIP, CERDIP and chip package.

Introduced in the 1960s, the DIP package was widely used for decades and still exists to hold microcontrollers and other electronic circuits.

Lots of DIPs
Taking up more room than BGA and other chip packages that are used today, DIP chips were popular in the past. See chip package.
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References in periodicals archive ?
Users can construct detailed models of ball grid arrays, dual inline packages, and quad flat packages.