This packaging option is available in a wide variety of ceramics, among them ceramic ball grid array (CBGA), ceramic dual-inline package
(CDIP), and leadless chip carrier (LCC).
The ACNV4506 optocoupler is available in a 500 mil 10-pin dual-inline package
(DIP) as well as a gull wing lead option for standard surface mount processes, both with 13-mm creepage and clearance that meets the IEC60664-1 standard.
Avago's new SSRs are dual channel, providing two independent Form A (normally open) single-pole single-throw (SPST) relays in an industry-standard 8-pin dual-inline package
The ADNS-3080 optical mouse sensor is supplied in a 20-pin staggered dual-inline package
(DIP) and designed for use with the Agilent ADNS-2120 (round or trim) lens, the ADNS-2220 (clear or black) LED assembly clip, and the HLMP-ED80-XX000 LED illumination source.
60 (USD) in either 20-pin small outline integrated circuit (SOIC) package or plastic dual-inline package
The FOD2741 incorporates an optocoupler, precision reference, and error amplifier into an 8-pin white, dual-inline package
, making it the functional equivalent of a Fairchild KA431 shunt voltage regulator and a CNY17F-3 optocoupler in a single, space saving device.
Housed in an industry-standard 8-pin dual-inline package
(DIP), the SFH67xx features a fast data rate of 5 Mbits/s (2.
HP intends to offer a range of products for intermediate and long-reach telecommunications specifications operating at both 155Mb/s and 622Mb/s in a dual-inline package
with detachable pigtails featuring MT-connector technology.
The components included three 64-pin connectors with gold finish, three plastic dual-inline packages
(DIP) with 16 pins and 100% tin matte finish, and 25 axial resistors with 100% tin finish.
Machine centers were dedicated to radial components, axial components and dual-inline packages
Some of the key benefits provided by this new optocoupler series include a smaller stretched SO-8 (SSO-8) package which meets 8mm clearance and creepage requirements, and requires 30 percent less printed circuit board space compared to dual-inline packages
Avago's ACPL-C78A/C780/C784 family of isolation amplifiers come in a new stretched SO-8 package with a footprint that is 30 percent smaller than conventional dual-inline packages
(DIP), yet meet 8 mm creepage and clearance requirements.