electroless plating

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Related to electroless plating: electroplating

electroless plating

Deposition of a metal coating by immersion of a metal or nonmetal in a suitable bath containing a chemical reducing agent.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.

Electroless plating

A chemical reduction process which, once initiated, is autocatalytic. The process is similar to electroplating except that no outside current is needed. The metal ions are reduced by chemical agents in the plating solutions, and deposit on the substrate. An advantage of electroless plating with current is the more uniform thickness of the surface coating.

Electroless plating is used for coating nonmetallic parts. Decorative electroless plates are usually further coated with electrodeposited nickel and chromium. There are also applications for electroless deposits on metallic substrates, especially when irregularly shaped objects require a uniform coating. Electroless copper is used extensively for printed circuits, which are produced either by coating the nonmetallic substrate with a very thin layer of electroless copper and electroplating to the desired thickness or by using the electroless process only. Electroless iron and cobalt have limited uses. Electroless gold is used for microcircuits and connections to solid-state components. Deeply recessed areas which are difficult to plate can be coated by the electroless process. See Electroplating of metals

McGraw-Hill Concise Encyclopedia of Engineering. © 2002 by The McGraw-Hill Companies, Inc.
References in periodicals archive ?
Obviously, this is due to the rough surface of carbon fiber fabrics (Figure 5), after electroless plating contributed significantly to the improvement of interfacial adhesion between carbon fibers and epoxy matrix.
(4) Immersion in electroless plating solution: The substrate is immersed in a electroless plating solution of the type of metal to be formed into wires, and the metal in the plating solution is deposited along the gold nanoparticles fixed on the primer surface, forming the metal pattern.
"Photocatalytic Pretreatment of Acrylonitrile-Butadiene-Styrene Polymer for Electroless Plating." Scripta Mater..
In summary, we prepared (Sm,Pr)C[O.sub.5]/Fe nanocomposites via electroless plating. The addition of a complexing agent effectively controls the coating morphology, to obtain a continuous and uniform Fe layer.
The electrolytic nickel strikes were used to activate the electroless plating process by using the 10 times diluted plating bath at a constant potential of -2 V versus saturated calomel electrode.
This means that the complicated three-dimensional shape of the actuator can be fabricated while the current fabrication method can only provide a two-dimensional shape, like the strip-type, because the IPMC actuator is usually cut into the strip-type after the electroless plating of electrodes.
(5.) Mallory, GO, Hajdu, JB, Electroless Plating: Fundamental and Applications.
Electroless plating is a chemical process that catalytically reduces metal ions in an aqueous solution and deposits that metal on a substrate without the use of electrical energy.
Table 1: Composition of electroless plating baths for depositing CoNiP coating (mol/L) Bath [Ni.sup.2+] or [Co.sup.2+] Reducing agent CoNiP 0.04 NiS[O.sub.4] x 6[H.sub.2]O 0.20 0.06 Na[H.sub.2]P[O.sub.2] CoS[O.sub.4] x 7[H.sub.2]O x [H.sub.2]O Bath Complex agent Buffer agent pH CoNiP 0.40[C.sub.4] 0.10 pH=9 [H.sub.6][O.sub.5] [(N[H.sub.4]).sub.2] 0.30[C.sub.3][H.sub.4]O S[O.sub.4] 0.50[C.sub.4][H.sub.4] [Na.sub.2][O.sub.4] x 6[H.sub.2]O Annotations: temperature was kept at 80[degrees]C for electroless deposition.
The studies present recent research results and reviews on thin film coating, laser surface technologies, surface nano-technologies, anodizing, electroplating, electroless plating, and thermal and cold spray.
Alps Electric, a major device manufacturer in Japan, has developed a new copper wiring technology by using electroless plating on glass substrates.
He has written numerous publications in addition to authoring several patents involving electroless plating and corrosion inhibitor additives for paint and coatings.