Hybrid Memory Cube


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Hybrid Memory Cube

A memory module technology from the Hybrid Memory Cube Consortium (HMCC), spearheaded by Micron and Samsung, that stacks chips vertically rather than horizontally. Finalized in 2013, Hybrid Memory Cubes (HMCs) provide 15 times the bandwidth of DDR3 chips while consuming 70% less power and 90% less space. Like DRAM, HMCs lose their content without power.

Initially used in supercomputers and high-speed servers, HMC memory is expected to migrate to all types of computing devices. See dynamic RAM, memory module and via.


3D Stacking
DRAM layers are stacked over a logic layer and connected with "vias" (corner cutout) that run through the silicon. This compact architecture is faster and more energy efficient than conventional DRAM modules. (Image courtesy of the HMC Consortium, www.hybridmemorycube.org)
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The major drivers, restraints, challenges, and opportunities for the Hybrid Memory Cube and High-Bandwidth Memory market have been detailed in this report.
Hybrid Memory Cube uses a stacked memory chip configuration, forming a compact "cube," and uses a new, highly efficient memory interface which sets the bar for energy consumed per bit transferred while supporting data rates of one trillion bits per second.
It also supports a full range of dynamic RAM models including DDR4, Low Power DDR4, Hybrid Memory Cube, High Bandwidth Memory-2, and the new JESD229-2 Wide I/O-2 standard.