Non-ideal power and IR drop
analysis is a key to meeting the needs of today's nanometer designers as the supply voltage lowers, performance rises, and geometry shrinks.
Fast and efficient DC solver (for IR drop
verification) -- 64-bit capability for all solvers -- Frequency-dependent source implementation -- Linear interpolation to fit external source datasets -- External sources can have frequency-dependent impedance -- Frequency-dependent material model (Djordjevic-Sarkar) -- Causal trace and via models -- Visualization of near E and H fields -- Clip Design tool to quickly remove extraneous portions of complex designs -- Improved dynamic link between SIwave and HFSS -- Link based on both E- and H-field -- Automated frequency spectrum transfer using dynamic link to Nexxim v3.
In addition to providing graphical voltage IR drop
analysis, FinePower also supports electromigration requirements.
July 10 /PRNewswire/ -- ACAD Corporation today announced that LG, a world leader in the design and manufacture of high performance Digital TV solutions, has selected ACAD's FinePower Dynamic Power & IR Drop
analysis tool, for the design and verification of complex full-chip used in LG's latest Digital TV.
This platform also solves signal and power integrity issues such as crosstalk and IR drop
SignalStorm SoC also incorporates instance-based IR-drop data from Simplex's industry-leading VoltageStorm(TM) SoC, to account for the effects of IR drop
on path delays.
When used in conjunction with Power and Timing extensions, the SI extensions to ECSM will accurately measure the cumulative impact of IR Drop
and Noise on delay to provide a more holistic view of timing as well as power sign-off.
CoolTime is the industry's most accurate dynamic voltage drop analysis and optimization solution, concurrently analyzing timing, signal integrity, static IR drop
, power, and electromigration.
Increased plane resistance (as IR drop
from power supplies to BGA pads).
In lower resistivity soils, the IR drop
tends to be small.
0 introduces SiP design solutions for the first time including SiP package design, electrical analysis of package extraction, timing, signal integrity, IR drop
, and thermal to physical verification of DRC and LVS.
Today's low-voltage, high-current designs require DC IR drop
analysis for off-chip power distribution systems in order to optimize end-to-end voltage margins for every device on the distribution.