IR drop

IR drop

[¦ī¦är ′dräp]
(electricity)
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive ?
Post-layout parasitic simulation and electromigration and IR drop (EM-IR) analysis and integrated signoff: Includes parasitic extraction, DRC, and layout versus schematic (LVS) checks.
In addition, Keysight said its EEsof ADS 2017 includes a new ElectroThermal simulator for PIPro, which provides a complete solution for the power integrity (PI) workflow, such as DC IR drop, DC electrothermal, and PDN impedance analysis.
Invarian's InVar product family is TSMC certified for 20nm and 16nm FinFET+ V0.9 to enable sign-off analysis accuracy for static and dynamic IR drop analysis and electromigration verification, and the collaboration is on-going to conclude 16nm FinFET+ v1.0 certification.
However, in terms of IR drop, organic has the advantage, and simulations have shown that organic packages are eight times better in this aspect than silicon.1 As users evaluate interposers for lower-cost applications, organic is once again under consideration.
In this way a total of 58 sets of [I.sub.corr] values were determined with and without IR drop compensation utilizing the developed setup and calculation procedure, as presented in Table 3.
The potentials shown in each of the figures include the native potential (Ecorr), the on- and off-potentials, the "decayed-off" potential (potential measured during depolarization), and the "rest potential" (potential when depolarization becomes steady), or the polarization growth or decay and the IR drop.
In the DC domain, IR drop analysis quickly identifies problem areas on a PCB (where the layout will not provide sufficient current to the components) or potential over-design (where costly layers can be reduced).
Cadence technology, in collaboration with TowerJazz, enables: schematic design, AMS verification, RF and transient noise analysis, yield sensitivity analysis, constraints-driven layout, analogue placement and routing, physical verification, DFM-aware parasitic extraction, IR drop and electromigration analysis.
FineSim Pro also has a separate option for IR drop and electromigration analysis.
Flip chip reduces pitch for the top package of a PoP, and improves electrical performance for devices such as baseband processors by delivering power directly to the processor core, along with reduced IR drop and reduced EMI.
By virtue of the predefined structures, the ASIC vendors drastically reduce risky and time-consuming tasks because test, signal integrity and IR drop are accounted for in the architecture.