intermetallic compound

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intermetallic compound

[¦in·tər·me′tal·ik ′kam‚pau̇nd]
(metallurgy)
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The diffusion region mainly consisted of intermetallic Ti[Al.sub.3], and intermetallics Ti[Al.sub.2], TiAl, and [Ti.sub.3]Al were formed in sequence in the diffusion front of Al, with decreasing Al content and increasing Ti content.
The heating rate was set to 2 K/min in order to maintain the original shape of the compact discs, with porous PdAl intermetallics prepared.
LI Xia-wei et al [1] joined the aluminium alloy 1350 plates with pure copper and found that no intermetallic compounds were present in the weld nugget.
Behavior of P phase in AA5083 during friction stir welding, Intermetallics 35: 120-127.
His activities and research on intermetallic y-TiAl based alloys for more than two decades have significantly contributed to the fact that they are presently seen as key structural materials for high-temperature application in advanced jet and automotive engines of the next generation.
The machining characteristics of aluminum-silicon alloys depend on microstructural features such as shape, size and morphology of the eutectic silicon particles, the dendrite morphology of a-aluminum, and the morphology and amount of other intermetallics.
These phases are Al-Fe intermetallics and Al(Fe) oxides, demanded for hardening/strengthening purposes (e.g., Al oxide has been used as reinforcement in Al alloys [21] or [Al.sub.13][Fe.sub.4] has been recognised as major hardening phase in surface hardening of Al by Fe-ion implantation [22]).
The exposed surface shows evidence of localized attack at the location of the Intermetallics caused by the dissolution of the matrix.
Abstract: The effects of Bi addition on the intermetallic phase formation in the lead-free solder joints of SnAgCu1, 0Bi (composition given in weight %) with copper substrate are studied.
After aluminizing treatment, samples cross section the structure and the mechanism of thickness changes of formed coatings with time in microcrystalline and nanocrystalline samples were compared.The results of the present study, which are available at Intermetallics, volume 18, pages 1517-1523, 2010, show that the beginning time of aluminide coating formation at a definite temperature is reduced as a result of sublayer being nanostructured and the type of coating is also converted from single-layered to double-layered (during long time aluminizing).The growth (thickening) rate, nevertheless, showed no significant difference between micro and nanostructured samples of thick coatings.
This volume contains 12 invited papers on ultra-high-temperature ceramics, refractory borides, and oxide ceramics, including their composites, intermetallics, and CMCs.
Silver embrittlement ([Ag.sub.3]Sn intermetallics) of solder joints may occur when the finish thickness exceeds IPC-4553 recommendations and Pb-free, high silver content solders are used.