J-lead

J-lead

A pin on a chip package that extends down and around under the housing like a reverse "J." J-leads are used on SOJ chips. See SOJ and gull-wing lead.
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* Availability with gold-plated J-lead, tin/lead-plated J-lead, and gold-plated undertab terminations.
Basic J-lead tantalum capacitors have metal leads attached to the sides of the capacitor body and wrapped under the capacitor, which provides complete mechanical decoupling from the PCB, and enables extremely high vibration resistance.
In a conventional molded J-lead package, the anode wire is welded to one side of the J-lead, and the cathode side is glued to a lead frame pocket with a conductive epoxy.
Or I could bend the leads under to approximate a J-lead part.
The J-lead and gullwing configurations are superior to the standard through-hole.
X-ray inspection of a lifted J-lead (Figure 1) was part of an investigation to pinpoint the possible cause of open joints.
Due to the non-wetting (no-flow) characteristic of lead-free solder, J-Lead and Gull Wing component leads are not recommended.
This product offers numerous advantages over alternative technologies, including two surface-mount packaging options (ball-grid and J-lead), an orientation independent footprint, small physical outline, excellent temperature stability (< 2 ppm/[degrees]C), low insertion loss (< 0.3 dB/ns), and less than 0.5[degrees] p-p phase ripple.
Additionally, J-lead packaging technology is used to reduce footprint to .39-inch x .50-inch (9.8mm x 12.6mm), requiring minimal board space.
Currently, the PVG3 series offers two terminal shapes: J-lead (PVG3A) and Gull Wing (PVG3G).
In a conventional molded, J-lead package (FIGURE 4), the anode riser wire is welded to one side of the J-lead, while the tantalum element, which features an external cathode coating, is affixed to a lead frame pocket with conductive epoxy.