Going forward, MHI will further intensify its proposal-based approach to potential customers to expand the adoption of room-temperature bonding as a key technology for 3-D LSI circuit production.
With 3-D LSI circuits, the key lies in achieving technologies for creating electrodes through multiple layers, in order to send signals between layered wafers, and for bonding electrodes with high reliability.
Going forward, MHI intends to expand use of room-temperature bonding technology, which can secure higher alignment accuracy than heated bonding and realizes repeated wafer-layer bonding without heat stress, for application in 3-D LSI circuit
Tokyo, Japan, Feb 4, 2008 - (JCN Newswire) - TDK Corporation announced today the development of the GBDriver RS1 Series NAND Flash memory controller LSI circuit
. Sales will begin in March.
Intrinsic fluctuations in transistors are currently considered to be a major obstacle to stable LSI circuit
functionality in the future.
(5) Power-gating technology 'CoolAdjust-PG': A technology used to temporarily switch off power to blocks of LSI circuits
that aren't in use, and to reduce leak current.