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motion compensated prediction
MCP(1) See Microsoft certification.
(2) (Master Control Program) See operating system.
(3) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). MCPs are also tested after packaging, whereas the bare chips of ceramic-based MCMs were tested before packaging so as not to waste the more costly ceramic substrate if the chips were no good. See MCM.
|These are examples of multichip packages with stacked chips (top) and side-by-side chips (bottom). The chips are wire bonded to the resin-based substrate which is attached to the printed circuit board using a ball grid array (BGA). (Illustration courtesy of Joseph Fjelstad.)|