MicroBGA


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MicroBGA

A CSP BGA chip package from Tessera Inc., San Jose, CA (www.tessera.com). The µBGA architecture uses very fine pitch between the solder balls that enable the packaging to be barely larger than the chip itself. Tessera's unique design uses elastomer layers to withstand changes in temperature between the printed circuit board and the chip (CTE). See CSP, BGA and CTE.


µBGA Packages
Tessera's µBGA packaging allows for very small chip footprints on the printed circuit board as is obvious from this picture. (Image courtesy of Tessera Inc.)
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Since the microBGA package is more compact than other SMT devices, it has a shorter contact length from the device pin to the outside world.
A microBGA's electrical performance shows that it has low resistance, capacitance and inductance of the short beam leads.
This means that before finalizing a microBGA for design, the designer should carefully analyze the microBGA device's details and make sure the balls' pin pitch allows for all traces fanout/ routing without using unnecessary special manufacturing requirements, and that it can be done within the allowed number of layers.
Perhaps the best-known design is the micro-ball grid array (microBGA), developed and licensed by Tessera.
CSPs and microBGAs are area array devices that offer outstanding function and electrical performance.
IPC-9850 specifies the accuracy required for each of five test components: two quad flat packs (QFP100 and QFP208); micro-ball grid array (microBGA); 1608C capacitor; and small outline integrated circuit (SOIC16).
The system can be used by PCB and semiconductor manufacturers to conduct real-time inspection of BGA, microBGA, flip chip, chip-on-board, bond wires and other applications needing precise measurement.
Q: What is the nature of the residue remaining under the microBGA?
A high I/O microBGA, with a low standoff under standard aqueous (water only) cleaning techniques produced a product that left visual residues and ionic levels well above cleanliness limits for good electrical performance.
Components assembled included four area array packages: one microBGA with 46 I/O chip scale package (CSP), one 48 I/O CSP, a flex-based 144 I/O and a laminate-based 64 I/O CSP.
However, consider a 20-mil micro ball grid array (microBGA) with a 10-mil aperture in a 5-mil-thick stencil.
Figure 5 shows the relative paste volume for a 20-mil pitch microBGA with 10-mil square apertures with 2.5-mil radius corners.