Soldering


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Related to Soldering: Silver soldering

Soldering

A low-temperature metallurgical joining method in which the solder (joining material) has a much lower melting point than the surfaces to be joined (substrates). Because of its lower melting point, solder can be melted and brought into contact with the substrates without melting them. During the soldering process, molten solder wets the substrate surfaces (spreads over them) and solidifies on cooling to form a solid joint.

The most important technological applications of solders are in the assembly of electronic devices, where they are used to make metallic joints between conducting wires, films, or contacts. They are also used for the routine low-temperature joining of copper plumbing fixtures and other devices. In addition, solder is used in the fusible joints of fire safety devices and other high-temperature detectors; the solder joint liquefies if the ambient temperature exceeds the solder's melting point, releasing a sprinkler head or triggering some other protective operation.

Tin or indium content is included in solder to facilitate bonding to the metals that are most commonly soldered, such as copper (Cu), nickel (Ni), and gold (Au). Tin and indium form stable intermetallic compounds with copper and nickel, and indium also forms intermetallics with gold. The intermetallic reaction at the solder-substrate interface creates a strong, stable bond. See Alloy, Intermetallic compounds

Soldering

 

the process of joining solid materials by means of molten solder. Soldering involves a mutual dissolving and diffusion of the material being joined and the solder; the gap between the parts being joined is thus filled. Soldering results in solid joints for items made of steel, cast iron, glass, graphite, and ceramic and synthetic materials. The numerous methods of soldering are classified according to the means of heating, the conditions under which the gap is filled, the method of cleaning the surface, the formation of the seam, and other factors.

Metal soldering, the most common type of soldering, is arbitrarily divided into soldering with hard and soft solders. When hard solders are used, joints are heated by gas torches, electric arcs, or high-frequency currents in muffle, tunnel-type, and other furnaces. Soldering with soft solders can be done with soldering irons or gas torches; it can also be done by immersion in molten solder and by other means.

REFERENCES

Lashko, N. F., and S. V. Lashko. Paika melallov, 2nd ed. Moscow, 1967.
Petrunin, I. E., S. N. Lotsmanov, and G. A. Nikolaev. Paika metallov, 2nd ed. Moscow, 1973.
References in periodicals archive ?
Because the RE elements could improve chemical reactions at the interface and provide very strong bonding during soldering, the increase of the IMC thickness of the Sn-58Bi-0.5Ag-0.1RE solder after aging was less than that of the Sn-58Bi-0.5Ag solder.
Because small nozzles are used, much heat must be transferred through a small amount of solder into the board, connectors and pads to enable soldering. Therefore, the flux must support temperatures of at least 280[degrees]C.
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The system automatically applies flux and molten solder to through-hole component leads without disturbing adjacent SMT components, and provides solder quality that is significantly superior to hand soldering with consistent barrel fill and topside solder fillets.
Hand soldering of high-density printed boards demands highly skilled operators to ensure a zero-defect soldering process, and this contest--IPC's annual competition at SMT Hybrid Packaging--will recognize the best skills in hand soldering complex printed board assemblies.
The good wetting properties of the solder are a prerequisite for good solder joints, which is directly related to the reliability of the solder joints; therefore the wettability of the soldering process is listed as an important factor [15].
Before soldering, the samples were thoroughly cleaned.
Overlapping doesn't have to be used only when substituting for a wave soldering machine.
What are the best settings for a wave soldering process?