surface-mount technology

(redirected from Surface Mount Devices)

surface-mount technology

[′sər·fəs ¦mau̇nt tek′näl·ə·jē]
(electronics)
The technique of mounting electronic circuit components and their electrical connections on the surface of a printed board, rather than through holes.
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As a franchise distributor of Good-Ark Semiconductor, New Yorker Electronics now supplies its full line of Semiconductor Diodes, Rectifiers, Bridge Rectifiers, Protection devices (TVS, Chip Fuse & Thermistor) and MOSFETS (Small Signal & Power MOSFETS supported by Trench Technology) in through-hole to surface mount devices as well as wafer/bare die for hybrid applications.
Some of the highlights included with IPC-6012DA are the identification of automotive performance classes, recommendations for sustainability and reliability testing identification, and solder makes thickness coverage over conductors, planes, and adjacent surface mount devices. The addendum also provides requirements for hole size, hole pattern accuracy, and pattern feature accuracy requirements.
Tantalum capacitors, which are widely available as chipstyle surface mount devices, radial leaded conformally coated devices, or axial leaded wet tantalum parts, can typically withstand temperatures up to 125[degrees]C.
Adhesives are used to place surface mount devices (SMDs) in semiconductor and ICs.
Surface mount devices have become key components for mobile products by offering increased component density and improved performance.
Directly mounted on the circuit board, SMD LEDs (SMD = "Surface Mount Devices") illuminate key symbols in specially designed keycaps using the MX RGB switch in the entire RGB color spectrum - all 16.7 million RGB colors.
In response to the increased use of surface mount devices (SMD), WIELAND ELECTRIC has introduced a range of Through Hole Reflow (THR) connector solutions for use with two piece connectors and single piece terminal blocks.
Stanyl ForTii is pitched largely at electronics applications and meets requirements for lead-free soldered surface mount devices such as circuit boards used in personal computers, as well as the current move towards halogen-flee electronics.
Tyco provided a reel to reel system that allows GSI to mount flip chips, surface mount devices and printed batteries on a continuous web of printed antennas and conductive traces.
Higher processing temperatures of lead-free alloys require component suppliers to reclassify moisture sensitive devices as covered in J-STD-020, Moisture/Reflow Classification for Non-hermetic Solid State Surface Mount Devices. J-STD-020 revision C specifies that the temperature for moisture sensitivity level testing be selected according to thickness, volume and mass of the component, and also raises the maximum MSL testing temperature to 260[degrees]C (from 250[degrees]C).
Higher processing temperatures of Pb-free alloys require component suppliers to reclassify moisture sensitive devices as covered in J-STD-020, Moisture/Reflow Classification for Non-hermetic Solid State Surface Mount Devices. J-STD-020 revision C specifies that the temperature for moisture sensitivity level testing be selected according to thickness, volume and mass of the component, and also raises the maximum MSL testing temperature to 260[degrees]C (from 250[degrees]C).
This series of compact, low profile surface mount devices is an addition to the company's FILMTRIM [R] plastic dielectric trimmer capacitors.

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