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(1) By means of, by way of. From Latin for "way" or "path."

(2) (Virtual Interface Architecture) See VI.

(3) (Vertical Interconnect Access) In a printed circuit board, a conducting pathway between two or more substrates (layers). The via is created by drilling through the board at the appropriate place where two or more layers will interconnect and allowing copper to run through the hole. The copper may coat only the sides of the hole or fill the entire hole. See printed circuit board.

(4) (Vertical Interconnect Access) In a chip, a conducting pathway between two or more layers. In a 3D chip, two or more stacked dice are connected via "through-silicon vias" (TSVs) which are pathways that pass completely through the die.

Creating Vias
In the antifuse programmable chip technology, a circuit is closed by turning non-conductive silicon into a conductive via. See antifuse.
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References in periodicals archive ?
* Most of the participants are thermally comfortable in the investigated office, with 92.6% votes inside TSV comfort range;
shows a methodology for constructing the regression model using compact TSV parasitic equations and SPICE simulation results.
Increases in SSD capacity typically are coupled with increased power consumption and reduced performance -- CNEX's NVMe SSD controller and Toshiba Memory Corporation TSV technology reverse this trend, delivering enterprise and data center customers high capacity drives with low power, combined with IOPS per terabyte (TB) scalability.
Combining a 48-layer 3D flash process and TSV technology has allowed Toshiba Memory Corporation to successfully increase product programming bandwidth while achieving low power consumption.
However, ZAIS gives no assurance if or when the sale of the TSV Property will be consummated.
The Luxemburger also leads the points classification and the best young riders standings while Amaury Capiot (TSV) conquers the Most Aggressive rider's jersey.
A single 8GB HBM2 die contains over 5,000 TSV holes,
After drawing 1-1 with Bundesliga high-fliers Borussia Monchengladbach, they play second-tier TSV 1860 Munich at the 12,500-capacity Grunwalder Stadion in Munich (6pm BST).
One of the critical steps in the TSV manufacturing process is achieving a void-free fill of the high aspect ratio vias during plating.
Thus several new DRAM memory architectures based on 3D layer stacking and TSV have evolved to carry memory technology forward, explains research group Yole Developpement in its recently released report on 3D ICs titled "3DIC & 2.5D TSV Interconnect for Advanced Packaging--2014 Business Update."
"We are pleased to have achieved this important milestone, which validates the trust our customers have in Syndion's capabilities, not only to address expanding CIS applications, but also to tackle tough TSV integration challenges," said Vahid Vahedi, group vice president, Etch Product Group.
WHITTINGHAM 30, VELIKONJA 88 TSV 1860 MUNCHEN ...2 SCHINDLER 28, WITTEK 37 ETIEN Velikonja wasn't supposed to play in Cardiff City's opening match on their pre-season tour to Austria.