tape-automated bonding


Also found in: Wikipedia.

tape-automated bonding

[¦tāp ‚ȯd·ə‚mād·əd ′bän·diŋ]
(electronics)
A semiconductor chip (die) assembly method, where the chips are connected to polyimide (tape) carriers, complete with circuitry for attachment to a printed circuit board. The chip-bonded tape carriers typically are supplied on a reel (like a roll of film) for automated circuit assembly processes.
References in periodicals archive ?
The Consortium was first founded by Universal's SMT Laboratory in 1991 as the Ultra-Fine Pitch Consortium and has supported the development of tape-automated bonding (TAB), ultra fine pitch (UFP) quad flat packs (QFPs), ball grid arrays (BGAs), chip .
Face-down wired flip chip technologies are covered along with an area array tape-automated bonding type of flip chip.
Applications for plastic dielectric materials include inexpensive chip carriers manufactured by tape-automated bonding (TAB), and the manufacture of cables that interconnect circuit boards.
Tape-automated bonding, used to manufacture chip carriers such as the one shown in Fig.