GlacialTech's experience in thermal design allows the Igloo SS250 to create a heatsink boasting an excellent thermal resistance
using stamping technology.
For a wire in the air, the dissipated heat power [P.sub.otd] depends on the thermal resistance
of the ambient air [R.sub.oc] and the surface temperature of the wire [T.sub.p] and the medium temperature [T.sub.c] 
In the interest of accurately expressing the thermophysical parameters of the different components in the energy pile system, the concept of thermal resistance
is used, meaning that the heat transfer between the exchange fluid and the host soil can be calculated by
Therefore, it is important to account for both a climates' wind and temperature conditions to study how air leakage affects thermal resistance
, energy loss through the building envelope, and evaluate the relative importance airtightness has in different climates.
The plastic mold package features a thick Cu heat spreader located under the chip for lower thermal resistance
. Thermal resistance
can be reduced by using a thick Cu heat spreader because the heat generated by the chip spreads not only directly under the chip but also laterally.
It is due to the formation of the liquid film at the inner side of condenser section resulting in the high thermal resistance
between the vapor of the working fluid and the cooling medium in the condenser.
The end user was interested in lowering the overall thermal resistance
of the system design and avoiding using BeO due to its toxicity.
For example, the local requirements were been increased to thermal resistance
of enclosure structure .
With increasing thermal resistance
of the floor covering (carpet instead of tile), as well as the floor construction above the tubes, the cooling capacity decreases if the Entering Water Temperature (EWT) is kept constant.
However, relatively low thermal resistance
and flammability are considered as the most important problems of this copolymer for industrial applications.
In the present paper we focus attention on thermal resistance
across dimensionally mismatched SWCNT-graphene junctions in the 3D PGS.