Transfer Molding


Also found in: Wikipedia.

transfer molding

[′tranz·fər ‚mōld·iŋ]
(engineering)
Molding of thermosetting materials in which the plastic is softened by heat and pressure in a transfer chamber, then forced at high pressure through suitable sprues, runners, and gates into a closed mold for final curing.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
The following article is from The Great Soviet Encyclopedia (1979). It might be outdated or ideologically biased.

Transfer Molding

 

a method for manufacturing articles of various shapes from thermosetting plastics in which the material is softened (plasticated) in the injection cylinder (crucible), from which it is injected into the compression mold, where it hardens and assumes the configuration and dimensions of the article. In some cases, the injection cylinder may be loaded with plasticated material from an extruder. Transfer molding is performed in all-purpose presses, with a plunger for closing the mold and for injecting material into the mold, or in specialized presses, in which the mold is closed by one plunger and the material is injected by a second plunger.

Transfer molding is used for manufacturing articles of complex configuration and high dimensional precision, with small fittings, and with deep openings, as well as with large differences in wall thickness. The technology and equipment of transfer molding are intermediate between pressure molding of polymeric materials and injection molding.

REFERENCE

Zavgorodnii, V. K. Mekhanizatsiia i avtomatizatsiia pererabotki plasti-cheskikh mass, 3rd ed. Moscow, 1970.

V. K. ZAVGORODNII

The Great Soviet Encyclopedia, 3rd Edition (1970-1979). © 2010 The Gale Group, Inc. All rights reserved.

transfer molding

An injection molding using a thermosetting material.
McGraw-Hill Dictionary of Architecture and Construction. Copyright © 2003 by McGraw-Hill Companies, Inc.
References in periodicals archive ?
In the last five years, HCR transfer molding has had a rebirth in the USA to accommodate material customization and larger silicone parts.
Resin Transfer Molding (RTM) 370 Resin for High-Temperature Applications is a solvent-free resin with a low-melt viscosity and a long pot-life, suitable for low-cost liquid molding and complex parts fabrication in high temperature applications.
Impregnating large fiber structures during vacuum-assisted resin transfer molding (VARTM) without defects is difficult because of viscous resins.
Is deploying high-pressure resin transfer molding (HP-RTM) to produce visible body panels such as roofs with carbon-fiber reinforced plastics.
In addition, KM's Reaction Process Machinery unit supplied 20 machines for thermoset high-pressure resin transfer molding (HP-RTM) of composite supporting structures such as the side frame to BMW plants in Leipzig and Landshut.
MedPlast's expertise includes injection molding, liquid injection molding, two-shot molding, over molding, insert molding, multi-component molding, extrusion, blow molding, injection blow molding, injection stretch blow molding, silicone extrusion, compression and transfer molding, and precision mold making.
MedPlast, whose expertise includes injection molding, blow molding, silicone extrusion, compression and transfer molding, liquid injection molding (LIM), two-shot molding, over molding, insert molding, multi-component molding and precision mold making, will now become an one-stop supplier for the healthcare and non-medical product markets, it said.Country: USASector: Machinery/EngineeringTarget: United Plastics Group Inc (UPG)Buyer: MedPlast Inc
They describe a full array of processes, including molding, die forming and tooling, compression molding, transfer molding, injection molding, and extrusion.
A silica-filled liquid polymer, it encapsulates wires, locking them in place and prohibiting their movement during process transition and transfer molding. The encapsulation technology enables die shrinks, fine pitch designs, long wire applications with high-density substrates and 35 [micro]m roadmap wire bonding.