ultrasonic bonding


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ultrasonic bonding

[¦əl·trə′sän·ik ′bänd·iŋ]
(metallurgy)
Bonding of two identical or dissimilar metals by mechanical pressure combined with a wiping motion produced by ultrasonic vibration.
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References in periodicals archive ?
Karlsbad, Germany-based Herrmann Ultrasonics, which supplies ultrasonic bonding technology to machinery builders and end users, recently developed a new and automated ultrasonic assembly line--with complete ultrasonic laminating and sealing steps--for a new and patented abdominal swab called texart by Portuguese medical producer BastosViegas.
The company also has plunge-welding systems in pneumatic and servo-controlled versions for performing stationary ultrasonic bonding.
The system ordered encompasses an ultrasonic bonding head and a high force bonding head equipped with a confinement chamber that reduces oxide on bumps and bonding pads.
The IC tag inlay will be produced by applying a propritary ultrasonic bonding technology.
Additionally, it works well with post-processing steps such as ultrasonic bonding, spin welding, adhesive bonding, and heat staking.
Milliken has a new woven fabric for automotive airbags and Sonobond's ultrasonic bonding can be used for sealing nonwovens for automotive air filters.
Available in 20- and 35-kHz sizes, the modules are said to provide greater flexibility for automation projects using ultrasonic bonding or cutting.
This project will focus on the collective development of novel ultrasonic bonding equipment and innovative stretch fibers for the construction of stretch laminates, without the use of hot melt elastic attachment adhesives.
Over the next few weeks we will be able to validate several additional new approaches for later use, including ultrasonic bonding (see NanoPierce Press Release of April 3rd), parallel to ramping up production.
To ensure that Sonobond's equipment satisfies specific requirements, it offers a free, no-obligation ultrasonic bonding viability test to produce sample assemblies with companies' nonwoven or synthetic fabrics.
of a new patent application protecting a recent invention related to ultrasonic flip chip bonding of semiconductor chips and ultrasonic bonding of other electronic components treated with NCS(TM) (NanoPierce Connection System).
Aurizon Ultrasonics has entered into an exclusive license agreement with CERA France to enable the manufacture and sale of its patented rotary ultrasonic bonding technology to secure elastic strands into nonwoven structures used in articles such as diapers and adult incontinence undergarments.