wave soldering

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wave soldering

[′wāv ‚säd·ə·riŋ]
(engineering)
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.

wave soldering

Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the board. The board is moved across the solder, which adheres to the flux and bonds the pins to the board. Contrast with reflow.
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References in periodicals archive ?
Protecting wave solder machines from the corrosive effects of Pb-free solders, Available from: http://www.specnor.com/pdf/Protecting_wave_solder_mac hines_from_the_corrosive_effects_of_Pb-free_solders.pdf Accessed: 2011-01-26
Bar code labels made from these polyimide materials demonstrate excellent performance in RoHS ("lead-free") wave solder environments on either the top or bottom side of the board, which range from 260[degrees] C to 290[degrees] C (500[degrees] F to 554[degrees] F).
In other designs, a multi-image panel may bow when supported only by the wave solder finger conveyor due to the width of the panel and the mass of the parts.
Although wetting balance test results do not predict wave solder performance, they do provide relative comparisons that demonstrate the effects of alloy composition, flux and temperature.
Solder recovery is a cost-effective and innovative technology that is easily transferable to other UK companies using wave solder assembly.
The ASM01 allows leaded components to effectively become SMT compatible, therefore eliminating the need to wave solder them.
Small SMDs that will be attached to the bottom-side of a PCB and then passed through a wave solder or solder dip machine (full body immersion) should be qualified to JESD22A111.4 Components frequently wave soldered in this manner include small discrete components, SOT-23 and lower I/O leaded devices with pitches [greater than or equal to] 1.27 mm (0.050").
The M22XDL-350 supports inspection of PCBs, including surface-mount and through-hole technology components, reflow and wave solder joints, and solder paste.
As many through-hole processes were largely indifferent to alloy, fragmentation of the wave solder alloy market quickly ensued.
Results of this work show how improvements in understanding and setup of wave solder, fluxing and wave configuration can help meet IPC-A-610 Class 3 hole fill requirements for heavy thermal loaded products.
Provided with press-fit terminations, this connector helps to avoid the cost and time of an additional wave solder process.