wire bonding

(redirected from Wirebonding)

wire bonding

[′wīr ‚bänd·iŋ]
(electricity)
Lead-covered tie used to connect two cable sheaths until a splice is permanently closed and covered.
(electronics)
A method of connecting integrated-circuit chips to their substrate, using ultrasonic energy to weld very fine wires mechanically from metallized terminal pads along the periphery of the chip to corresponding bonding pads on the substrate.
The attachment of very fine aluminum or gold wire (by thermal compression or ultrasonic welding) from metallized terminal pads along the periphery of an integrated circuit chip to corresponding bonding pads on the surface of the package leads.
References in periodicals archive ?
Contract awarded for Supply and Delivery of high-speed PCB Design, Fabrication, Wirebonding and Assembly
In order to allow optimization and miniaturization of the overall antenna size, IPDiA is launching a complete range of values from 10 pF up to 330 pF, fully compatible with existing Smart Card and RFID tag manufacturing processes (delivery in T&R or wafers), with same TC as standard RFID ICs and with proven assembly methods such as flip-chip and wirebonding.
IC bond pads must withstand the stress of probing at die sort, wirebonding during assembly, plastic molding during packaging, thermal cycles in board mount, and then the bond pads with their wirebonds are expected to perform reliably for many years in use.
This effort will extend the usefulness of wirebonding to smaller silicon nodes and is applicable with gold and copper wires, he says.
Suppliers of chip-making equipment confirmed that the two assemblers have notified them of their decisions to suspend the procurements of a combined NT$6 billion (US$187 million at US$1:NT$32) worth of copper wirebonding machines due partly to no contracts having been in sight since late August and partly to unsmooth migration to copper process from gold process at customers.
Plasma treatment also removes contaminates and oxidation, as well as increases surface energy for improved yields in wirebonding, component attach, encapsulation and underfill.
Wirebonding was used because the bare die active devices have contacts at both the top and bottom sides.
The top layer of the device is a ceramic substrate with gold bond pads that accommodate conventional wirebonding.
By means of wirebonding, electrical connections are made between the aluminum-alloy pads (on the chip) and the leadframe.
The association will concentrate on facilitating copper wirebonding for QFP packages in automotive microcontrollers and manufacturing.
Wirebonding is the other mechanical stress modeled, where a thin wire of gold (Au) or copper (Cu) alloy is welded onto the pad surface using a combination of downforce and ultrasonic energy.