thru-hole
Also found in: Wikipedia.(redirected from Through-hole technology)
thru-hole
A circuit board packaging technique in which the leads (pins) on discrete components and chips are inserted through holes in the printed circuit board and soldered from beneath. Until the late 1980s and prior to surface mount technology, all devices on circuit boards were thru-hole. Although chips are mostly surface mounted these days, some chips are still thru-hole, and most discrete devices such as resistors and capacitors are thru-hole.
Thru-hole devices have a strong bond with the board but require an extra drilling step. They also eliminate the board real estate underneath from being used for other layers. See surface mount.
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| Through the Board |
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| In this circuit board from an LED table clock made in 2005, not only the discrete components, but the chip, are thru-hole devices. |
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| Thru-Hole vs. Surface Mount |
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| The thru-hole chip is not only thicker than the surface mount chip, but it eliminates the real estate underneath because the pins stick through. The board designer must route any traces from other layers around that part of the board. |
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References in periodicals archive
The process had replaced the previously used method, i.e.,
through-hole technology (THT).
Facilities of the factory include surface-mounted technology (SMT) and
through-hole technology (THT).
The common-mode chokes are easily placed on the PCB with
through-hole technology and designed and approved according to IEC 60938, UL 1283, and CSA 22.2 no.
Through-hole technology has become more of a specialty, while surface mount is the basis for most of today's designs.
When surface mount was in its infancy and
through-hole technology was the de facto standard, anything in the SMT world either was genuinely innovative, or at least appeared to be so, and there was always a variety of new ideas and developments to see.
Microvia technology is the solution for 0.5-mm pitch devices since traditional
through-hole technology does not allow manufacturing tolerances required to fabricate PCBs with high yields and low cost.
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