tape-automated bonding
Also found in: Wikipedia.
tape-automated bonding
[¦tāp ‚ȯd·ə‚mād·əd ′bän·diŋ] (electronics)
A semiconductor chip (die) assembly method, where the chips are connected to polyimide (tape) carriers, complete with circuitry for attachment to a printed circuit board. The chip-bonded tape carriers typically are supplied on a reel (like a roll of film) for automated circuit assembly processes.
McGraw-Hill Dictionary of Scientific & Technical Terms, 6E, Copyright © 2003 by The McGraw-Hill Companies, Inc.
References in periodicals archive
The Consortium was first founded by Universal's SMT Laboratory in 1991 as the Ultra-Fine Pitch Consortium and has supported the development of
tape-automated bonding (TAB), ultra fine pitch (UFP) quad flat packs (QFPs), ball grid arrays (BGAs), chip .scale packages (CSPs), wafer scape package (WSP) and flip chip attach technologies.
Face-down wired flip chip technologies are covered along with an area array
tape-automated bonding type of flip chip.
Applications for plastic dielectric materials include inexpensive chip carriers manufactured by tape-automated bonding (TAB), and the manufacture of cables that interconnect circuit boards.
Tape-automated bonding, used to manufacture chip carriers such as the one shown in Fig.
Copyright © 2003-2025 Farlex, Inc
Disclaimer
All content on this website, including dictionary, thesaurus, literature, geography, and other reference data is for informational purposes only. This information should not be considered complete, up to date, and is not intended to be used in place of a visit, consultation, or advice of a legal, medical, or any other professional.