Development of a Defoaming and Highly Surface Active Substrate
However, in the long term, with standardization and through further technology improvements towards higher yield, better electrical performance, lower profile, better testability and smaller pitch features, Fan-out WLP and Embedded die technology could seriously compete in the fast growing 3D Packaging market space as they will both enable the construction of ever more complex, larger SiP modules with different active and passive functions, all connected on both sides of the active substrate
So Fan-out WLP and chip embeddeding into PCB laminates are just two additional key pieces of the widening tool-box for 3D Packaging
The system also allows non-confocal and confocal detection with scalable confocality according to planarity or bulkiness of the active substrate
Ormet's products include semiconductor packaging products, fine-line, micro-via interconnect products, thermally enhanced wiring boards, active substrate
products, and engineered material products (EMI shielding, jumper wire and embedded passives).
Lam's ESC, the first commercially available for large area glass substrates, provides active substrate
temperature control while improving etch rate uniformity and reducing particle generation.
Silicon Biosystems is one of the most innovative start-ups in the field of "lab-on-a-chip," based on active substrates
, as testified by a number of awards and recognitions.